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Hot in Sz! High Quality Multilayer Printed Circuit Board

China Hot in Sz! High Quality Multilayer Printed Circuit Board, Find details about China Circuit Boards, Pcba from Hot in Sz! High Quality Multilayer Printed Circuit Board

Model NO.
oem odm
Metal Coating
Copper
Mode of Production
SMT or DIP
Base Material
FR-4
Min. IC Pitch
0.30mm(12mil)
Foot Pin
So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
Min. Chip Placement
01005
Max. PCB Size
410mm X 600mm(16.2" X 23.6")
Min. PCB Thickness
0.35mm(13.8mil)
Maximum BGA Size
74mm X 74mm(2.9" X 2.9")
BGA Ball Pitch
1mm ~ 3mm(4mil ~ 12mil)
BGA Ball Diameter
0.4mm ~ 1mm(16mil ~ 40mil)
Qfp Lead Pitch
0.38mm ~ 2.54mm(15mil ~ 100mil)
Layers
1 ~ 30 Layers
Trademark
oem
Specification
RoHS, SGS, UL, IPC class II
Origin
China
HS Code
8534001000

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