830 Tie-Point Solderless Breadboard

China 830 Tie-Point Solderless Breadboard, Find details about China Solderless Protoboard, Breadboard from 830 Tie-Point Solderless Breadboard

Basic Info.

Model NO.

LL1071-4

Sizes

16.5*5.4*0.85cm

Power Lane

2 Power Lane, 200pts

Tie Point

830

Temperature Range

-20~80oc.

Specifications

1 Standard Double-Strip, 630pts

Application

PCB

Trademark

LANL

Transport Package

Ctns for 830tie-Point Solderless Breadboard

Specification

UL, CE, ROSH, ISO9001, ISO14001

Origin

Cixi, Ningbo

HS Code

853690190

Product Desciption

Products