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Multilayer PCB Built on RO4350b with Blind Via From Top to Inner Layer

China Multilayer PCB Built on RO4350b with Blind Via From Top to Inner Layer, Find details about China High Frequency PCB, Microwave PCB from Multilayer PCB Built on RO4350b with Blind Via From Top to Inner Layer

Model NO.
BIC-100-V100
Type
Rigid Circuit Board
Dielectric
RO4350b+RO4450b
Material
Hydrocarbon/Woven Glass
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Glass Reinforced Hydrocarbon
Final Foil External
1 Oz
Final Foil Internal
0.5 Oz
Board Thickness
1.0mm ±0.1
Surface Finish
Immersion Gold
Solder Mask Color
Green
Colour of Component Legend
White
Minimum Trace and Spac
4 Mil/4 Mil
Minimum / Maximum Holes
0.35 mm / 4.5 mm
Via
Minimum Size 0.35mm
Test
100% Electrical Test Prior Shipment
Trademark
Bicheng Enterprise Limited
Transport Package
Vacuum
Specification
100 x 105mm=1PCS
Origin
China
HS Code
5834009000

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