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Multilayer PCB 4 Layer Copper with Immersion Gold

China Multilayer PCB 4 Layer Copper with Immersion Gold, Find details about China Immersion Gold PCB, RF PCB from Multilayer PCB 4 Layer Copper with Immersion Gold

Model NO.
BIC-0364-V3.64
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Cu Thickness
35 Um (1oz)
Inner Iayer Cu Thicknes
35 Um (1oz)
Final Height of PCB
1.6mm +/-0.16
Surface Finish
Immersion Gold
Solder Mask Color
Black
Colour of Component Legend
N/a
Mininum Trace (Mil)
7.9 Mil
Minimum Gap(Mil)
5.5 Mil
Test
100% Electrical Test Prior Shipment
Trademark
Bicheng Enterprise Limited
Transport Package
Vacuum
Specification
204 x 122mm=8UP
Origin
China
HS Code
8534009000

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