Electronic Contract Manufacturing Customized Multilayer PCBA

China Electronic Contract Manufacturing Customized Multilayer PCBA, Find details about China LED PCB, PCB from Electronic Contract Manufacturing Customized Multilayer PCBA

Model NO.
OKey-am-0009
Application
Consumer Electronics
Mechanical Rigid
Rigid
Material
Fr4
Color
Green, Blue, Black, Red, Yellow etc.
Trademark
OKEY
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
UL ISO RoHS, REACH
Origin
Guangdong Shenzhen, China
HS Code
8534009000
Model NO.
OKey-am-0009
Application
Consumer Electronics
Mechanical Rigid
Rigid
Material
Fr4
Color
Green, Blue, Black, Red, Yellow etc.
Trademark
OKEY
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
UL ISO RoHS, REACH
Origin
Guangdong Shenzhen, China
HS Code
8534009000
Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Max. Board size2000×610mm 


Min. board Thickness
2-layer 0.15mm 
4-layer 0.4mm 
6-layer 0.6mm 
8-layer 1.5mm 
10-layer 1.6~2.0mm 
Min. line Width/Space0.1mm(4mil) 
Max. Copper thickness10OZ 
Min. S/M Pitch0.1mm(4mil) 
Min. hole size0.2mm(8mil) 
Hole dia. Tolerance (PTH)±0.05mm(2mil) 
Hole dia. Tolerance,+0/-0.05mm(2mil) 
Hole position deviation±0.05mm(2mil) 
Outline tolerance±0.10mm(4mil) 
Twist & Bent0.75% 
Insulation Resistance>10 12 Ω Normal 
Electric strength>1.3kv/mm 
S/M abrasion>6H 
Thermal stress288°C 10Sec 
Test Voltage50-300V 
Min. blind/buried via0.15mm (6mil) 

Surface Finished
HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold 

Materials
FR4,H-
TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control
±0.10 mm±0.10 mm
1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA
Electronic Contract Manufacturing Customized Multilayer PCBA


Place of Origin Guangdong, China (Mainland)
Brand Name OKEY
Model Number okey pcb
Base Material FR-4
Copper Thickness 1 OZ
Board Thickness 1.2 mm
Min. Hole Size 0.4mm
Min. Line Width 0.2mm
Min. Line Spacing 0.15mm
Surface Finishing HASL
Color red
Small order acceptable
Fire resistanceUL-94V0
Outline/contourmilling, V-cut, CNC Routing
100% productsE-test or flying probe test

Features

Thin board capabilities
Increase routing density in complicated desig
Excellent mounting stability and reliability
Qualified material and surface treatment for Lead-free process

Applications

Smartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD Module

Benefits

Well experienced manufacturer with good yiel
Multiple plants increase production output in short time
NOItemTechnical capabilities
1Layers1-20 layers
2Max. Board size2000×610mm
3Min. board Thickness2-layer  0.15mm
4-layer  0.4mm
6-layer  0.6mm
8-layer  1.5mm
10-layer  1.6~2.0mm
4Min. line Width/Space0.1mm(4mil)
5Max. Copper thickness10OZ
6Min. S/M Pitch0.1mm(4mil)
7Min. hole size0.2mm(8mil)
8Hole dia. Tolerance (PTH)±0.05mm(2mil)
9Hole dia. Tolerance (NPTH)+0/-0.05mm(2mil)
10Hole position deviation±0.05mm(2mil)
11Outline tolerance±0.10mm(4mil)
12Twist & Bent0.75%
13Insulation Resistance>10 12 Ω Normal
14Electric strength>1.3kv/mm
15S/M abrasion>6H
16Thermal stress288°C 10Sec
17Test Voltage50-300V
18Min. blind/buried via0.15mm  (6mil)
19Surface FinishedHAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base