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Resistance to High Pressure Ability Silicone Heat-Sink Cooling Thermal Pad for LED/PCB/Automoive

China Resistance to High Pressure Ability Silicone Heat-Sink Cooling Thermal Pad for LED/PCB/Automoive, Find details about China Thermal Pad, Heat Dissipation Pad from Resistance to High Pressure Ability Silicone Heat-Sink Cooling Thermal Pad for LED/PCB/Automoive

Model NO.
TS200
Material
Organic Silicone
Application
Industrial
Certification
REACH, RoHS
Thickness
0.5-8mm
Hardness
30
Breakdown
>6
Volume Resistivity
9.6*10^12
Flame Rating
V-0
Thermal Conductivity
2.0
Specific Gravity
2.5
Color
Gray
Trademark
TENSAN
Transport Package
According to Customers′requirements
Origin
China
HS Code
3920999090

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