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Silicone Rubber Cooling Conductive Insulation Heat-Sink Cooling Thermal Pad for Electronic Component

China Silicone Rubber Cooling Conductive Insulation Heat-Sink Cooling Thermal Pad for Electronic Component, Find details about China Thermal Gap Filler Pad, Thermal Pad from Silicone Rubber Cooling Conductive Insulation Heat-Sink Cooling Thermal Pad for Electronic Component

Model NO.
TS200
Material
Organic Silicone
Application
Industrial, Electronic
Certification
ISO, REACH, RoHS, 16949
Thickness
0.5-8mm
Hardness
30
Breakdown
>6
Volume Resistivity
9.6*10^12
Flame Rating
V-0
Thermal Conductivity
2.0
Specific Gravity
2.5
Color
Gray
Trademark
TENSAN
Transport Package
Normal Packing
Specification
0.5-8mm
Origin
China
HS Code
3920999090

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