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3G Thermal Paste Chipset CPU Cooling Compound Silicone Grease 8.8W

China 3G Thermal Paste Chipset CPU Cooling Compound Silicone Grease 8.8W, Find details about China Thermal Paste, Thermal Grease from 3G Thermal Paste Chipset CPU Cooling Compound Silicone Grease 8.8W

Model NO.
TS88
CAS No.
63148-62-9
Formula
Al2O3
Bonding Function
Heatsink
Morphology
Paste
Application
Automobile, LED Light \CPU
Material
Silicone
Classification
Not Curing
Main Agent Composition
Polyurethane Elastomer
Characteristic
Heatsink
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Grey
Model
Ts88
Viscosity
80000cp
Thixotropy
1:6
Nvc
99.93%
Specify Gravity
2.0 Uncured
Thermal Conductivity
8.8 W/M.K
Thermal Resistance
0.09
Package
20g/Tub, 1kgs/Can
Logo
Tensen/Customized
Brand
Tensan/No Mark/OEM
Trademark
Tensan/No mark/OEM
Transport Package
Normal Goods
Specification
1000g
Origin
China
HS Code
3824999990

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