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8.8 W/M. K Thermal Grease Heatsink Compound Interface Material for CPU GPU LED Electronic Components

China 8.8 W/M. K Thermal Grease Heatsink Compound Interface Material for CPU GPU LED Electronic Components, Find details about China Thermal Paste, Thermal Grease from 8.8 W/M. K Thermal Grease Heatsink Compound Interface Material for CPU GPU LED Electronic Components

Model NO.
TS88
CAS No.
63148-62-9
Formula
Al2O3
Bonding Function
Heatsink
Morphology
Paste
Application
Automobile, LED Light \CPU
Material
Silicone
Classification
Not Curing
Main Agent Composition
Polyurethane Elastomer
Characteristic
Heatsink
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Grey
Model
Ts1001
Viscosity
80000cp
Thixotropy
1:6
Nvc
99.93%
Specify Gravity
2.0 Uncured
Thermal Conductivity
1.0
Thermal Resistance
0.09
Electric Strength
1.89kv/mm
Package
1000g/Bottle
Logo
Tensen/Customized
Trademark
Tensan/No mark/OEM
Transport Package
Normal Goods
Specification
1000g
Origin
China
HS Code
3824999990

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