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High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

China High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink, Find details about China Ceramic Substrate, Aln Substrate from High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

Model NO.
Customized
Dimensions
as Per Customer Requirement
Thickness
From 0.3mm to 1mm Available
Features
High Thermal Conductivity
Sample
Available
Payment
Negotiation
OEM
Acceptable
Shipping
Express/Air/Sea
Trademark
JingHui
Transport Package
Individual Packaging
Specification
Max. OD to be 400mm
Origin
China
HS Code
8547100000
Model NO.
Customized
Dimensions
as Per Customer Requirement
Thickness
From 0.3mm to 1mm Available
Features
High Thermal Conductivity
Sample
Available
Payment
Negotiation
OEM
Acceptable
Shipping
Express/Air/Sea
Trademark
JingHui
Transport Package
Individual Packaging
Specification
Max. OD to be 400mm
Origin
China
HS Code
8547100000
 High Thermal Conductivity Aluminum Nitride Ceramic Wafer For Heat Sink
High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink
Product Description
High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink
1. High thermal conductivity (170 ~220) W/m.k,  it's 5~8.5 times higher than that of alumina


2. Similar coefficient of thermal expansion to that of silicon (Si), it helps to achieve high reliability of Si chip


3. High insulation resistance and voltage resistance strength, but low dielectric constant and dielectric loss


4. High mechanical strength, it's up to 450MPa and very dense ceramic body free of porosity


5. It offers very high purity up to 99%, also it's free of toxicity and meets RoHS, REACH regulation


The specification of ceramic wafers and substrate

Material
 		Aluminum nitride (AlN), alumina(al2o3), zirconia(ZrO2), silicon nitride(Si3N4), silicon carbide(SiC)
 
Color
 		Gray, black, white, pink, ivory, yellowish are available
 
Typical thickness
 		0.385mm, 0.50mm, 0.635mm, 1.0mm, 1.2mm and 1.5mm
 
Dimensional capability
 		Max. side-length to be 500mm by 400mm, Max OD to be 400mm
 
Tolerance 
 		OD can be ± 0.01mm, Thickness can be ± 0.005mm
 
Surface treatmentnatural surface, lapping, diamond-like polishing, metallization, glazed
 

Remark:
We produce a selection of ceramic wafers in different materials, customized designs, including alumina ceramic wafers, zirconia ceramic wafers, silicon nitride ceramic wafers, and silicon carbide wafers.

The description of AlN ceramic wafers and substrate 
The aluminum nitride ceramic wafer offers a super high thermal conductivity of more than 170W/m. K, high resistivity, low dielectric loss, good insulation, and some other excellent properties. The ALN wafer is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipment such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products, and so on.

AlN substrate can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT), LED packages for cooling and protecting circuits, packages, and modules.
Typical Applications

High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

Why choose us?

1. 10+ Years of manufacturing experience in OEM, ODM, and trusted & professional teams

2. Powerful R&D, prototyping & mass production capability to support trial order and high volume production

3. In-house comprehensive manufacturing types of equipment from raw materials to high precision machining

4. Rigorous quality control system and processes, including IQC, IPQC, QA, OQC in working instructions

5. Surpassing pre-sales, sales, and after-sales service abide all orders every customer as the first priority
High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

Products category
High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink
Certifications

High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

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High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

FAQ

Q1. Are you a factory or trading company?

A: We are a direct professional manufacturer of technical ceramics. You are welcome to visit our factory.

Q2: Do you send a sample to check?
A: Sure, the free sample with standard design in stock can be supplied, but freight collect.

Q3: When can I get the price?
A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of getting the price.
Please call us or tell us in your email so that we will proceed with your inquiry as a priority.

Q4: Is it available to provide customized products?
A: We always support custom-made ceramic sheets as per different materials, dimensions, and designs.

Q5: What other products do you manufacture?
A: Yes, we also produce metalized ceramics, ceramic tubes, zirconia ceramic parts, ceramic seals besides ceramic wafers

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