High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer

China High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer, Find details about China Ceramic Disc, Aln Ceramic Substrate from High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer

Model NO.
OEM
Thickness
0.3 ~ 1, 1~2mm
Thermal Conductivity
More Than 170W/Mk
Density
>3.60
Trademark
HB
Transport Package
Export Carton and Wooden Case
Specification
OEM
Origin
Jiangsu
HS Code
6903900000
Model NO.
OEM
Thickness
0.3 ~ 1, 1~2mm
Thermal Conductivity
More Than 170W/Mk
Density
>3.60
Trademark
HB
Transport Package
Export Carton and Wooden Case
Specification
OEM
Origin
Jiangsu
HS Code
6903900000

Product Description

PRODUCT DETAILS

Aluminium Nitride (AlN) is an ideal choice for heat dissipation substrate in electrical applications. It has high mechanical hardness, high thermal conductivity, similar thermal expansion coefficient with Si, excellent electrical resistivity and good chemical stability. Besides, Aluminium Nitride is non-toxic.
The aln ceramic substrate which has high thermal conductivity of more than 170W/m. K, high resistivity, low dielectric loss, good insulation and some other excellent properties. The ALN substrate is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipments such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products

 

 
aluminum nitride ceramic disc wafer substrate:
Property Content:Property Index
Density(g/cm3):3.335
Resistance to Thermal Shock:No Cracks
Thermal conductivity(30°C, W/m.k):≥170
Linear expansion coefficient 
(/°C, 5°C/min, 20-300°C):2.805×10-6
Flexural strength (MPa):382.7
Volume Resistivity (Ω.cm):1.4×1014
Dielectric constant(1MHz):8.56
Chemical Durability (mg/cm2):0.97
Dielectric strength (KV/mm):18.45
Surface roughness Ra(μm):0.3~0.5
Camber (length‰):≤2‰
Appearance/ Color:Dense/ Dark Gray

Note: Laboratory test performed by sample Actual characteristics of production lots may vary.  

High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer
 
High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate WaferA. Very high thermal conductivity
B. Excellent electrical insulation(Low dielectric constant and loss)
C. Low density
D. Extremely high hardness

 
 

Company Profile

LianYungang Highborn Technology Group is a research and development, production, international trade integration company, which focus on advanced ceramic materials research and development, production and processing. Our main business is porous ceramics and precision ceramics, products are widely used. Since its establishment, relying on the team's outstanding R & D capabilities, has applied for a number of patent technology, become a national high-tech enterprises. The company has provided professional ceramic solutions to customers in more than 100 countries, has been well received and established a long-term cooperative relationship. We are committed to R & D and production of high-quality ceramic materials, attach importance to scientific and technological innovation, keep pace with the times, in order to meet the needs of customers, with the majority of customers cooperation, development, win-win!

High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer
High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer
High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer

 

Packaging & Shipping

 

High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer
High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer

Certifications


High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer
High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate WaferHigh Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer
High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer

Our Advantages

1. HIGHBORN established 10 years ago, much experience and instant technical support.

2. OEM,ODM,OBM is acceptable,Pls send your requirement (design).

3. Good packing: Export carton or wooden box.

4.Specialized in 95.5%,96%,99% alumina ceramic, zirconia ceramic, silicon ceramic and so on.

5. Professional 24 hours after-sale team.
High Thermal Conductivity Aluminum Nitride Ceramic Disc Substrate Wafer

 

FAQ

Q:Are you a manufacturer or trading company ?

A:We are professional manufacturer in China ,and have in this line for almost 10 years.
 

Q:Will your company supply samples?

A:Of course,if we have sample in stock,we will be glad to offer you free samples.
 

Q:Would it be possible for us to visit your factory?

A:Sure, we welcome you at any time! Seeing is believing.
 

Q:Do you support OEM?

A:Yes
 

Q:Which payment terms are you accept?

A:T/T, LC, Western Union, Money Gram,etc

 

 


WELCOME TO HIGHBORN