China ESD Antistatic Plastic Packing Bag for IC, PCB with Desicccant and Hic, Find details about China PCB Bag, Barrier Bag from ESD Antistatic Plastic Packing Bag for IC, PCB with Desicccant and Hic
Thickness | 140±10μm (Total thickness of layer of glue and static is 5-10μm) Z | |
Physical properties | Material | Parameters |
Lay 1 | Polyester (PET) | 12μm |
Lay 2 | Aluminum foil (AL) | 7μm |
Lay 3 | Nylon (NY) | 15μm |
Lay 4 | Polyethylene (PE) | 100μm |
No. | Test item | Technical requirements | Test standard |
1 | Performance of Anti-static | 1x105Ω<resistance of outer surface<1x109Ω 1x105Ω<resistance of internal surface<1x1011Ω Metal layer<1x100Ω | ANSI/ESD STM 11.1 |
Friction voltage: <100V | ESD ADV 11.2 | ||
2 | Electrostatic shielding | Remanent shield voltage: <20V | EIA 541 |
3 | EMI Attenuation | >60 dB | MIL-PRF-81705 |
4 | Life time | After using 1 year, still meet the requirements of No. 2/3/4 | MIL-PRF-81705 |
5 | Structure | PET/ AL/ NY/ PE | |
6 | Thickness | > 0.14 mm | |
7 | Size | Refer to drawing's marks | |
8 | Heat-seal strength | > 30N/ 15mm | |
9 | Tensile strength (vertical and horizontal direction) | Vertical >75N/ 15mm Horizontal >85N/ 15mm | |
10 | Heat-seal condition | Temperature: 300-400F Time: 0.6-4.5 seconds Pressure: 30-70 PSI | |
11 | Peel strength | >3.0N/ 15mm | |
12 | Puncture resistance | >100N | MIL-STD-3010 |
13 | Water vapor permeance | J-STD-033 0.002mg/100 in2 /24h | ASTM F 1249-13 |