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Desk Lead Free Reflow Oven T200c

China Desk Lead Free Reflow Oven T200c, Find details about China Smt Bga Reflow Oven, Lead Free Reflow Oven from Desk Lead Free Reflow Oven T200c

Model NO.
F2C
Highest Temperature
350 Degree
Heating System
Electric
Condition
New
Customized
Non-Customized
Trademark
SMTVIP
Transport Package
Carton Package or Wooden Package
Specification
ISO9000 ISO14000
Origin
Beijing
Model NO.
F2C
Highest Temperature
350 Degree
Heating System
Electric
Condition
New
Customized
Non-Customized
Trademark
SMTVIP
Transport Package
Carton Package or Wooden Package
Specification
ISO9000 ISO14000
Origin
Beijing
Desk Lead Free Reflow Oven T200C
Desk Lead Free Reflow Oven T200c

Features:
1 with infrared and hot air cycle and centrifugal fan which is little noise and large air pressure, it is high successful welding.
2 the reflow oven can weld QFP\BGA\CSP, the min chip is 0402, 0.3mm space of IC. And it is suitable for single side, double side, multi size board
3 push-pull drawer, it is convenient for use. It can be used to unsolder, repair and other function.
4 heaters can be used for long time and don't need clean.
5 it is easy to operate. Automatic welding and easy using.
6 it is suitable for small and middle enterprises, university and scientific research. This machine can test SMD in industry.
Product details picture:
Desk Lead Free Reflow Oven T200c

Technology parameters:
1 temperature segment: 50 segments which is the same with 50 temperature zones. It can simulate preheating, heating, heat preservation, cooling and other parameters. SMT temperature profile is the international standard. Customers can adjust temperature profile according to actual request.
2 max PCB size: 250mm x 180mm
3 highest temperature: 350 degree
4 power: AC 220V
5 rated power: 0.8KW
6 weight: About 10kg
7 dimension: 530 mm x 330 mm x 250 mm

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