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BGA136 Gddr Test Socket with F Interposer & Removable Lid

China BGA136 Gddr Test Socket with F Interposer & Removable Lid, Find details about China Gddr Test Socket Test Adapter, Connect IC Chip Size of 12X14mm from BGA136 Gddr Test Socket with F Interposer & Removable Lid

Model NO.
702-0000284
Pin Count
136
Pitch Size
0.8mm
IC Size
12X14mm
Payment Term
Ex-Works
Transportation
by FedEx/DHL/UPS Express
Payment Type
100% T/T Advance
Life Span
50K Cycles
Spring Force
20g ~ 30g Per Pin
Current Rating
Min. 1.2A
Trademark
Sireda
Transport Package
Carton
Specification
BGA136
Origin
Shenzhen, China
HS Code
8536690000
Model NO.
702-0000284
Pin Count
136
Pitch Size
0.8mm
IC Size
12X14mm
Payment Term
Ex-Works
Transportation
by FedEx/DHL/UPS Express
Payment Type
100% T/T Advance
Life Span
50K Cycles
Spring Force
20g ~ 30g Per Pin
Current Rating
Min. 1.2A
Trademark
Sireda
Transport Package
Carton
Specification
BGA136
Origin
Shenzhen, China
HS Code
8536690000
1. Photos for 702-0000284
Overall Photo




 
BGA136 Gddr Test Socket with F Interposer & Removable Lid
Socket Lid                      BGA136 Gddr Test Socket with F Interposer & Removable Lid
 
SocketBGA136 Gddr Test Socket with F Interposer & Removable Lid
F interposer     BGA136 Gddr Test Socket with F Interposer & Removable Lid
 
   
2. Product Features
1. Test, debug and validation of devices BGA, LGA, QFP, QFN, SOP, etc.
2. Pitch option from 0.35mm to 1.27mm.
3. It is designed to avoid problems of pad co-planarity, oxidation and damage of PCB board after de-soldering.
4. This solution is patented.
5. The compact, surface mount design reuiqures no tooling, no extra place or mounting holess in the target PC board, maximizing real estate while reducing board cost.
6. Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy maintenance.
7. Fully removable double latch turning lid is good for both manual and automatic operation.


3. Product Parameters
Mechanical Material Socket BodyPEEK Ceramic
Material Socket Lid              AL, Cu, POM 
ContactPogo Pin
Operation Temperature-40 ~ 120 ºC
Life Span50K Cycles
Spring Force20g ~ 30g per Pin
Solder Ball96.5Sn/3.0Ag/0.5Cu (SAC305)
ElectricalCurrent RatingMin. 1.2A
DC ResistanceMax. 100mΩ


4. How it work
BGA136 Gddr Test Socket with F Interposer & Removable Lid
Step 1: Solder F interposer to PCB board.
Step 2: Attach Socket using four supplied screw.
Step 3: Insert device by hand or with the aid of a vacuum pen(recommended).
Step 4: Place and lock lid, screw down heat sink actuator for device engagement.


5. Company Information
BGA136 Gddr Test Socket with F Interposer & Removable Lid

Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include: Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.


6. Contact us
   BGA136 Gddr Test Socket with F Interposer & Removable LidShenzhen Sireda Technology Co., Ltd.
AddArea A,Floor 6, Building 4, the 10th Industry Park, GuangMing District,Shenzhen 518132
  
We provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have a look at our website: siredatech.en.made-in-china.com.
 

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