1. Introduction
F92EUUM23 is a highly integrated and excellent performance Wireless LAN (WLAN) USB network interface device. High-speed wireless connection up to 300 Mbps.
1.1 Overview
The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8192EU. It is a highly integrated single-chip 2*2 MIMO (Multiple In Multiple Out) Wireless LAN (WLAN) USB network interface controller complying with the 802.11n specification. It can work in two modes: Infrastructure and Ad-Hoc It combines a MAC, a 2T2R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective.
1.2 SPECIFICATION REFERENCE
This specification is based on additional references listed as below.
iEEE 802.11b
iEEE 802.11g
iEEE 802.11n
1.3 System Characteristics
| Main Chipset | Realtek RTL8192EU |
| Operating voltage | 3.3V(3.0-3.5V) |
| Host Interface | USB 2.0 |
| Operating channel | 2.4G: 1-13 |
| Operating Frequency | 2.4G: 2.405~2.485GHz |
| WIFI Standard | IEEE 802.11b/g/n ,IEEE 802.11e(WMM),IEEE 802.11i(WPA,WPA2),IEEE 802.11hTPC ,IEEE 802.11k,WAPI |
| Modulation | 11 n: MCS |
| 11 g: OFDM |
| 11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps) |
| PHY Data rates | 11n:6.5~72.2Mbps(20MHzBandwidth),13~300Mbps(40MHzBandwidth) |
| 11g: 54,48,36,24,18,12,9,6 Mbps |
| 11b: 11,5.5,2,1 Mbps |
| Transmit Output Power | 802.11b@11Mbps 16±2dBm
802.11g@54Mbps 14±2dBm
802.11n@65Mbps 13±2dBm (MCS 0_HT20)
13±2dBm (MCS 7_HT20)
13±2dBm (MCS 0_HT40)
13±2dBm (MCS 7_HT40) |
| Receiver Sensitivity | 300 Mbps:-65dBm@10% PER;
130 Mbps:-70dBm@10% PER;
108 Mbps:-70dBm@10% PER;
54 Mbps:-70dBm@10% PER;
11 Mbps:-87dBm@8% PER;
6 Mbps:-90dBm@10% PER;
1 Mbps:-92dBm@8% PER |
| Operation Range | Up to 100meters in open space |
| RF Power | <14dBm@11n,<18dBm@11b,<15dBm@11g |
| RF Antenna | External Antenna (2.4GHz 50Ohm Resistance) |
| OS Support | Android/ Win 8 /Win 7 /Vista/ Linux/ Win CE /Windows XP |
| Security | WEP,TKIP,AES,WPA,WPA2 |
| Operating Temperature | -20~ +50°C Ambient Temperature |
| Storage Temperature | -40~ +70°C Ambient Temperature |
| Humidity | Operating Temperature 10% to 90%maximum (non-condensing) |
| Storage Temperature 5% to 90%maximum (non-condensing) |
| Dimension | Typical 12.90X12.19X1.4mm |
Mechanical Specification
2.1 Outline Drawing(Unit: ±0.15mm)
2.2 Pin Definition
| Pin # | Name | Description |
| 1 | VCC | Power Supply Voltage (3.0-3.5V) |
| 2 | U- | USB DATA PIN (USB DM) |
| 3 | U+ | USB DATA PIN (USB DP) |
| 4~5 | GND | GROUND |
| 6 | RFB | RFB OUTPUT/INPUT |
| 7 | RFA | RFA OUTPUT/INPUT |
| 8 | CLK | EXTERNAL 40MHz CRYSTAL(HOLD) |
| 9~14 | NC | NO CONNECTED |
2.3 Layout reference(Unit:mm)
2.4 Application Circuit
3. Electric Current
Test Environment:Win XP SP3,Voltage:3.3V
| ITEMS | 2.4G Current (mA) |
| WLAN module not connecting with AP | 129 |
| WLAN module connecting with AP | 150 |
| Disable WLAN module | 0.8 |
| WLAN RF OFF | 19 |
| Tx (n mode 40MHz MCS15) | 340 |
| Rx (n mode 40MHz MCS15) | 220 |
| Tx (n mode 40MHz MCS7) | 83 |
| 802.11g mode |
| Tx (OFDM 54M) | 245 |
| Rx (OFDM 54M) | 195 |
| 802.11b mode |
| Tx | 270 |
| Rx | 185 |
4. Package
4.1 blister packaging
A piece of 100 PCS
4.2 the take-up package
A roll of 2000pcs
5. User's Manual
5.1 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
5.2 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ºC for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ºC, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: <= 30% ºC, <= 60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ºC, 8 hours.
3.) after baking, put the right amount of desiccant to seal packages.