These Pads are designed for random orbital machines and have a reduced diameter and are a slim profile design, these pads provide the most evenly distributed point of contact that makes these pads the ultimate DA pad for balance and control. The improved interface gives greater stability on flat panels while still being able to adjust to the contours of curved areas. The pads have been designed to minimise micro marring and haze while still activating the compound or polish to work at its full potential. The pads run extremely cool and are very resistant to delamination.