Doube Sided PCB, Double Layer Print Circuit Board, Double Sided Printed Circuit Board PCB
China Doube Sided PCB, Double Layer Print Circuit Board, Double Sided Printed Circuit Board PCB, Find details about China PCB, Printed Circuit Board from Doube Sided PCB, Double Layer Print Circuit Board, Double Sided Printed Circuit Board PCB
Basic Info.
Processing Technology
Delay Pressure Foil
Base Material
Fr4
Insulation Materials
Epoxy Resin
Brand
Zapon
Surface
OSP,Immersion Gold,Hal Lead Free,Hal
Solder Mask
Green,Red,Yellow,White,Black,Blue,etc
Shipment
Air,Sea,Express(DHL TNT FedEx EMS UPS)
Sample Date
3-5days
Trademark
ZAPON
Transport Package
Vacuum Packing
Specification
UL, TS16949, IPC 600 CLASS 2
Origin
China
HS Code
85340090
Processing Technology
Delay Pressure Foil
Base Material
Fr4
Insulation Materials
Epoxy Resin
Brand
Zapon
Surface
OSP,Immersion Gold,Hal Lead Free,Hal
Solder Mask
Green,Red,Yellow,White,Black,Blue,etc
Shipment
Air,Sea,Express(DHL TNT FedEx EMS UPS)
Sample Date
3-5days
Trademark
ZAPON
Transport Package
Vacuum Packing
Specification
UL, TS16949, IPC 600 CLASS 2
Origin
China
HS Code
85340090
Product Desciption
doube sided pcb, double layer print circuit board, double sided printed circuit board pcb
ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.
The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
We promise:
Reliable quality
Reasonable price
Flexible lead time
| Item | Capabilities | |
| Number of Layers | Double Side | |
| Material | FR-4,CEM-3,HighTg, Aluminum, Halogen Free | |
| PCB Thickness | Min.thickness | 0.2mm(8mil) |
| Max.thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
| Immersion Gold(Silver) | ||
| HAL Lead Free | ||
| Hot Air Solder Leveling(HASL) | ||
| Entek Coating (OSP) | ||
| Solder Mask | Green,White,Black,Yellow,Red,Blue | |
| Other printing | Gold Finger | |
| Carbon Print, Peelable Mask | ||
| Solder Mask Plugged Hole | ||
| Copper thickness | 1/ 2 oz (18 um) - 4 oz (140 um) | |
| Min. Finished Hole Size | 0.3mm(12mil) | |
| Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
| Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
| Min. Line Width and Spacing | 0.10mm (4 mil) | |
| Min. Solder Mask Clearance | 0.076mm (3 mil) | |
| Min. Annular Ring | 0.1mm (4mil) | |
| Profile and V-Cut | CNC-Routing, Stamping and Beveling,V-CUT,CNC | |
| Special Process | Micro-section, Chamfer for Gold Finger | |
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