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High Frequency Telecommunication Print Circuit Board PCB Board with UL Certification

China High Frequency Telecommunication Print Circuit Board PCB Board with UL Certification, Find details about China PCB, Circuit Board from High Frequency Telecommunication Print Circuit Board PCB Board with UL Certification

Model NO.
PCB & PCBA
Production Process
Semi-Additive Process
Base Material
Copper
Insulation Materials
Metal Composite Materials
Brand
Shenzhen Golden Tech Mirco Technology Co., Limited
Certification
IATF16949,UL,ISO14001,OHSAS18001,QC080000
Motherboard
Htg Fr4
Trademark
customized
Transport Package
Vacuum Packing/Blister/Plastic /Cartoon
Specification
normalization
Origin
China
HS Code
8534001000
Model NO.
PCB & PCBA
Production Process
Semi-Additive Process
Base Material
Copper
Insulation Materials
Metal Composite Materials
Brand
Shenzhen Golden Tech Mirco Technology Co., Limited
Certification
IATF16949,UL,ISO14001,OHSAS18001,QC080000
Motherboard
Htg Fr4
Trademark
customized
Transport Package
Vacuum Packing/Blister/Plastic /Cartoon
Specification
normalization
Origin
China
HS Code
8534001000
FAQ(PURCHASING TIPS)
1.MOQ:5 pcs is acceptable.
2.PCB inquiry: need pcb  Gerber file and technical description, or pcb details if no Gerber file.
3.PCBA inquiry: need Gerber file, technical description and component BOM List.
4.PCB clone: need the pcb sample, we can clone the pcb bare board and component.
5.PCB Design: need the detail information about the function or supply the drawing.
6.Other question: welcome to contact me by sending inquires, your satisfaction is our pleasure!
High Frequency Telecommunication Print Circuit Board PCB Board with UL CertificationHigh Frequency Telecommunication Print Circuit Board PCB Board with UL CertificationHigh Frequency Telecommunication Print Circuit Board PCB Board with UL Certification
Model Number:Pcb & PCB assembly
Base Material:FR-4,Hi-TG FR4,CEM-1,CEM-3
Copper Thickness:0.3oz-6oz
Board Thickness:0.4mm-12mm
Min. Hole Size:0.1mm
Min. Line Width:2.5mil
Min. Line Spacing:2.5mil
Surface Finishing:HASL, ENIG, OSP, HASL LEAD FREE, ENEPING, IMMERSION SILVER, IMMERSION TIN, GOLD FINGER, PLATING HARD GOLD, BLUE MASK SOLDER,
Layer No.1-48L Layers
PCB Test:Flying probe and AOI (Default)/Fixture Test
Base, Cover film, Stiffeners thickness::0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
BGA Ball Pitch:1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly Method:SMT, Through-hole, Mixed, BGA
PCB Assembly Test:Visual Inspection (default), AOI, FCT, X-RAY
Hi-TG FR4 Material:Tg-130 Tg-140 Tg-160 Tg-170
Electrical Testing:Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard:IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need
Special requirements:Buried and blind vias, Impedance control, via plug, BGA soldering etc.
Supply Ability500000 Square Meter/Square Meters per Month No MOQ
Packaging & Delivery1.Inner: Vacuum packing or Anti-static package; 2.Outer: Standard export carton;         3.Customized package.
Wireless ECG Electrodes PCB PCBA Assembly Manufacturer

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