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OEM SMD SMT Red Soldering Glue Adhesive for PCB BGA IC

China OEM SMD SMT Red Soldering Glue Adhesive for PCB BGA IC, Find details about China SMT Red Glue, SMT Adhesives from OEM SMD SMT Red Soldering Glue Adhesive for PCB BGA IC

Model NO.
TS4108A
CAS No.
63148-62-9
Formula
Al2O3
Bonding Function
Structural Adhesive
Morphology
Liquid
Application
Automobile, PCB/BGA/IC Chip/LED
Material
Epoxy
Classification
High Temperature Curing
Main Agent Composition
Inorganic Adhesive Material
Characteristic
Waterproof
Promoter Composition
Adhesive
Composition
Organic Material
Color
Red/Black
Model
Ts4108A
State
Liquid
Specific Gravity (g/cm3)
1.38
Adhesive Strength ( 2125c)
38n(3.9kgf)
Adhesive Strength (Mini-Mold Tr)
38n(3.9kgf)
Property( g/cm3 )
a: 1.23+0.02 B: 0.95+0.02
Adhesive Strength (Sop-IC 16p)
92n(9.4kgf)
Logo
Tensan/OEM
Packaged
Customized
Origin of Items
China
Type
Factory
Customized
Yes
Trademark
Tensan/No mark/OEM
Transport Package
Normal Goods
Specification
30ml/syringe, 200gl/syringe
Origin
China
HS Code
350691901

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