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Excellent Preservation Qualities SMT/SMD/BGA Red Glue for IC Chips

China Excellent Preservation Qualities SMT/SMD/BGA Red Glue for IC Chips, Find details about China SMT Adhesive, SMT Red Glue from Excellent Preservation Qualities SMT/SMD/BGA Red Glue for IC Chips

Model NO.
TS4109A
CAS No.
25085-99-8
Bonding Function
Structural Adhesive
Morphology
Paste
Application
Automobile, Construction, Packing, SMT
Material
Epoxy
Classification
Hot Curing
Main Agent Composition
Expoxy
Characteristic
Adhesive
Promoter Composition
Solvent
Composition
Organic Material
Color
Red
Thixotropy Index
5.0
Package Style
200g / 30cc
Specific Gravity
1.38 G/Cm^3
Viscocity at 25ºC
390000 Cps
Adhesive Strength
38n
Electric Property
1.8*10^1
Resistance Insulation
3.4*10^14
Resistance Initial Value
2.1*10^32
Curing Condition
150ºC/60sec
Applying Method
Screen Printing Thick Mask
Dielectric Constant
3.8(100kHz)
Dielectric Loss Tangent
0.027(100kHz)
Preservation Condition
Refrigerated Storage at 2~10ºC
Trademark
TENSAN
Transport Package
Refrigerated Storage
Specification
30ml/200G/360G
Origin
China
HS Code
350691901

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