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Communication Print Circuit Board One-Stop Service PCB Motherboard

China Communication Print Circuit Board One-Stop Service PCB Motherboard, Find details about China PCB, Circuit Board from Communication Print Circuit Board One-Stop Service PCB Motherboard

Model NO.
PCB & PCBA
Production Process
Semi-Additive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Shenzhen Golden Tech Mirco Technology Co., Limited
Trademark
customized
Transport Package
Vacuum Packing/Blister/Plastic /Cartoon
Specification
normalization
Origin
China
HS Code
8534001000
Model NO.
PCB & PCBA
Production Process
Semi-Additive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Shenzhen Golden Tech Mirco Technology Co., Limited
Trademark
customized
Transport Package
Vacuum Packing/Blister/Plastic /Cartoon
Specification
normalization
Origin
China
HS Code
8534001000
FAQ(PURCHASING TIPS)
1.MOQ:5 pcs is acceptable.
2.PCB inquiry: need pcb  Gerber file and technical description, or pcb details if no Gerber file.
3.PCBA inquiry: need Gerber file, technical description and component BOM List.
4.PCB clone: need the pcb sample, we can clone the pcb bare board and component.
5.PCB Design: need the detail information about the function or supply the drawing.
6.Other question: welcome to contact me by sending inquires, your satisfaction is our pleasure!
Communication Print Circuit Board One-Stop Service PCB MotherboardCommunication Print Circuit Board One-Stop Service PCB MotherboardCommunication Print Circuit Board One-Stop Service PCB MotherboardCommunication Print Circuit Board One-Stop Service PCB Motherboard
Model Number:Pcb & PCB assembly
Base Material:FR-4,Hi-TG FR4,CEM-1,CEM-3
Copper Thickness:0.3oz-6oz
Board Thickness:0.4mm-12mm
Min. Hole Size:0.1mm
Min. Line Width:2.5mil
Min. Line Spacing:2.5mil
Surface Finishing:HASL, ENIG, OSP, HASL LEAD FREE, ENEPING, IMMERSION SILVER, IMMERSION TIN, GOLD FINGER, PLATING HARD GOLD, BLUE MASK SOLDER,
Layer No.1-48L Layers
PCB Test:Flying probe and AOI (Default)/Fixture Test
Base, Cover film, Stiffeners thickness::0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
BGA Ball Pitch:1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly Method:SMT, Through-hole, Mixed, BGA
PCB Assembly Test:Visual Inspection (default), AOI, FCT, X-RAY
Hi-TG FR4 Material:Tg-130 Tg-140 Tg-160 Tg-170
Electrical Testing:Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard:IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need
Special requirements:Buried and blind vias, Impedance control, via plug, BGA soldering etc.
Supply Ability500000 Square Meter/Square Meters per Month No MOQ
Packaging & Delivery1.Inner: Vacuum packing or Anti-static package; 2.Outer: Standard export carton;         3.Customized package.
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