Fast Remove Particle Detailed Treating Polysilicon Ultrasonic Cleaning Machine
 

 1.Why Choose  Polysilicon Ultrasonic Cleaning Machine?

The surface contamination of wafers, especially by particle contaminants, has been one of the major problems in the semiconductor industry since its inception. The yield on fully processed silicon wafers is inversely related to the defect density of the wafers. One way to decrease defect density is to use efficient cleaning techniques that remove particle contaminants efficiently. Small particles are especially difficult to remove from wafers because of the strong electrostatic forces between the particles and the substrate. It is therefore imperative to find an effective way to remove particles from wafers with efficiency and without damage to the wafers.

Modern wafer manufacturing facilities use stringent contamination control protocols, including the use of clean-room suits, latex gloves, and highly purified ventilation systems. In combination with these protocols, modern manufacturing facilities use various methods of cleaning wafers, often involving pressurized water jet scrubs, rotating wafer scrubbers, wet chemical baths and rinses, and similar systems. These processes, however, are prone to damaging the wafer. In addition, the chemical processes have inherent dangers associated with the use of chemicals, such as sulfuric acid, ammonium hydroxide, and isopropylalcohol.

Ultrasonic cleaning involves a variety of complex mechanisms, including cavitation, mechanical vibration, etc., depending on whether liquids are used in the cleaning process or not. A typical ultrasonic source is a plane surface that oscillates at a single frequency, producing a longitudinal wave. Vibrational energy transmitted subsequently propagates through the fluid.

Ultrasonic cleaning is proved as a dominant cleaning method for silicon wafer by many expert and professor.

 2. How to Choose Polysilicon Ultrasonic Cleaning Machine?

According to many experiement, silicon wafer need different frequency to meet different size particle cleaning. If the particle is among 125~300um, 40KHz is perfect choice to clean. If the particle is among 53~90um, so 68KHz will be suitable. Therefore you need dual frequency cleaning in one machine. Our tank sized is customized according to your cleaning quantity and special requirement like drying and etc.
 

3.Featurs:

Other features of the Skymen Silicon Wafer Ultrasonic cleaner let you program the cleaning cycle with user-friendly keys and displays.Examples include

• Set and recall up to 5 user-defined cleaning programs
• Degas and mix fresh cleaning solutions to remove cavitation-inhibiting trapped air
• Activate the pulse mode for blasts of intense energy to remove stubborn deposits
• Activate the sweep mode to provide uniform distribution of sonic energy
• Adjustable utrasonic power to 100% in 40% steps
• Set the cleaning time and temperature

6.Packing information and delivery

7. Other  Recommendation

If tank size is not suitable for your metal stamped parts, we have other bigger ultrasonic cleaner in store. And we can design and produce any special function ultrasonic cleaning machine you need.

8.Skymen Advantage

We have been in this industry for 10 years and we are supplying machines to all seller all over the world.All distributor is welcome for win-win coperation.

We have passes ISO,High Tech Company,CE,RoHS,FCC, National Medical Instrument Approval.

ISO:

CE: