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Diamond Wafer Hubless Dicing Blade (1A8, 1A1, 1A1R , 1E1, 1B1) Disco, K&S, Adt

China Diamond Wafer Hubless Dicing Blade (1A8, 1A1, 1A1R, 1E1, 1B1) Disco, K&S, Adt, Find details about China Wafering Blade, Diamond Grinding Wheel from Diamond Wafer Hubless Dicing Blade (1A8, 1A1, 1A1R, 1E1, 1B1) Disco, K&S, Adt

Model NO.
1A8/1, 1A8/2, 1A1/3, 1E1, 1B1
Abrasive
Superabrasive
Size
10-150mm
Material
Diamond
Types
Surface Grinding Wheel
Working Style
Tool Grinding
Shapes
Edge Shape
Trademark
ZZSM
Specification
CE
Origin
Henan Zhengzhou
HS Code
6804210000

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