3D Printer Multi-Layer Rigid PCB Board Design

China 3D Printer Multi-Layer Rigid PCB Board Design, Find details about China Printed Circuit Board, PCB Board from 3D Printer Multi-Layer Rigid PCB Board Design

Model NO.
rigid-3
Production Process
Subtractive Process
Base Material
Aluminum
Insulation Materials
Organic Resin
Trademark
iso9001
Transport Package
Box
Origin
Shenzhen
Model NO.
rigid-3
Production Process
Subtractive Process
Base Material
Aluminum
Insulation Materials
Organic Resin
Trademark
iso9001
Transport Package
Box
Origin
Shenzhen
Shenzhen LvMeiJinYu Electronic Co.,Ltd

 
Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% product for oversea market of South America, Europe, Japan, India, Middle East, etc..

Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends.

Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.

 





3D Printer Multi-Layer Rigid PCB Board Design

3D Printer Multi-Layer Rigid PCB Board Design
3D Printer Multi-Layer Rigid PCB Board Design
3D Printer Multi-Layer Rigid PCB Board Design
3D Printer Multi-Layer Rigid PCB Board Design
3D Printer Multi-Layer Rigid PCB Board Design















 

PCB capability and services:


1.Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2.Flexible PCB (up to 10 layers)
3.Rigid-flex PCB (up to 8 layers)
4.CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5.HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6.Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7.Quantities range from prototype to volume production.
8.100% E-Test


 

  • PC-USB Inertial MEMS Evaluation System
  • Windows XP, Vista and 7 with 32-bit and 64-bit driver support
  • IMU and Vibration Evaluation software packages
  • Compatible with most ADIS1613x, ADIS162xx, ADIS163xx, ADIS164xx devices
  • Synchronous Data Capture at maximum sample rates
  • Register access for device configuration and validation
  • Standard, 16-pin ribbon cable interface with all ADIS16xxx breakout boards. 
  • Up to 2m of separation with DUT 
 

Detailed Specification of PCB Manufacturing

1

Layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.

3

Board thickness

0.2mm-6mm

4

Max.Finished board size

800*508mm

5

Min.Drilled hole size

0.25mm

6

Min.Line width

0.075mm(3mil)

7

Min.Line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

Green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

Standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

Detailed Specification of Pcb Assembly

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional tesQuality Assurance:

Our Quality processes include:
1.IQC:Incoming Quality Control (Incoming Materials Inspection)
2.First Article Inspection for every process
3.IPQC:In Process Quality Control
4.QC:100% Test & Inspection
5.QA:Quality Assurance based on QC inspection again
6.Workmanship:IPC-A-610, ESD
7.Quality Management based on CQC, ISO9001:2008, TS 16949, UL

 

Quotation Requirement :


Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM


 

Quality Assurance: 
 
Our Quality processes include: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, TS 16949, UL



 

Description

 

1. Aluminium PCB Circuit Layer

The circuit layer (commonly used electrolytic copper foil) is etched to form the printed circuit, Compared to FR4 material, Aluminium PCB can bear higher electric current when same thick circuit layer and same trace width.

 

2. Aluminium PCB Insulating Layer /Dielectic Layer

The insulating layer is the core technology of the Aluminium PCB, which mainly serves as the function of adhesion, insulation and heat conduction. The better the thermal conductivity of insulation is, the quicker the components spread the heat when they work, which can realize the purpose like improving power loading of the modules,reducing volume, extending life span and increase the output power. Shinelink has rich experience in manufacturing aluminium PCB with high thermal conductivity.

 

3. Aluminium PCB Metal Base Layer

Usually, considering the cost and technical characteristic, aluminium is the ideal choice. The available aluminum plates are 6061,5052,1060 etc. If there is a higher heat transfer performance, mechanical properties, electrical properties and other special performance requirements, copper, stainless steel plate, iron plate, silicon steel plate, etc can also be used.





Trade Capacity

Main MarketsTotal Revenue(%)
Eastern Europe15.00%
North America15.00%
Southern Europe10.00%
Oceania10.00%
Northern Europe10.00%
Western Europe10.00%
South Asia5.00%
Mid East5.00%
Southeast Asia5.00%
Central America5.00%
South America5.00%
Eastern Asia5.00%

Shipping Information:

  • FOB Port:Shenzhen
  • Lead Time:20 - 30 days
  • HTS Code:9030.89.01 00
  • Dimensions per Unit:45 × 40 × 30 Centimeters
  • Weight per Unit:20 Kilograms
  • Units per Export Carton:80
  • Export Carton Dimensions L/W/H:110 × 80 × 90 Centimeters
  • Export Carton Weight:5 Kilograms