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Good Quality PCB for Electronics with UL

China Good Quality PCB for Electronics with UL, Find details about China PCB, PCBA from Good Quality PCB for Electronics with UL

Model NO.
UC-3571
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Uc
Board Layer
1-24
Material Finished Thickness
0.4-3.2mm
Surface Treatment
Immersion Gold/HASL Lead Free/ Immersion Silve
Solder Mask Color
Green/White/Black/Blue/Red
Lead Time
5 Working Days
Certificate
UL(Us&Canada). ISO9001. RoHS, Ts, SGS
Trademark
UC
Transport Package
Vacuum Package
Specification
IPC class II
Origin
Shenzhen, China
HS Code
8534009000
Model NO.
UC-3571
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Uc
Board Layer
1-24
Material Finished Thickness
0.4-3.2mm
Surface Treatment
Immersion Gold/HASL Lead Free/ Immersion Silve
Solder Mask Color
Green/White/Black/Blue/Red
Lead Time
5 Working Days
Certificate
UL(Us&Canada). ISO9001. RoHS, Ts, SGS
Trademark
UC
Transport Package
Vacuum Package
Specification
IPC class II
Origin
Shenzhen, China
HS Code
8534009000
                                                     Ucreate LTD PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
 

1.Products Application

Good Quality PCB for Electronics with UL

 

2. Market Distribution
 
Good Quality PCB for Electronics with UL
 
 
3.Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control		±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness		 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist
 		0.75% 
 
4.Products Equipment

    Good Quality PCB for Electronics with UL

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