Infrared IC Heater Lead-free Reflow Oven T962A

1)Technical parameters

Soldering area: 300*320mm
Overall dimensions: 43*37*26cm
Packing dimensions: 51*45*33cm
Power: 1500W
Cycle time: 1-8 min
Voltage: AC110V-AC220V /50-60HZ
Net weight: 12.5Kgs
Gross weight: 15Kgs

2) Description

Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically, easy operate; Fast infrared and hot air heating, make temperature more accurate and evenness. Fuzzy temperature control technology, visualization drawer, can see the whole soldering process very clearly. It can achieve soldering of single and double-sides PCB board.

3) FEATURES

1. A large infrared soldering area
Soldering area: 180*235mm (T-962), 300*320mm (T-962A); This increases the usage range of this machine drastically and makes it an economical investment.
2. Choice of different soldering waves
Parameters of eight soldering waves are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
3. Special heat up and temperature equalization with all designs
Big power of energy efficient Infrared heating and air circulation to re-flow solder.
4. Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.
5. Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

Warranty
Warranty the main body maintains for one year and the spare parts maintains for three months.
Service provide the immediate network online Q/A and the technical advisory work service

Delivery
Safe packing and fast delivery by air express.