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Bergquist Aluminium PCB / Printed Circuit Board / Metal Core Board Thermal Clad MP- 06503

China Bergquist Aluminium PCB / Printed Circuit Board / Metal Core Board Thermal Clad MP-06503, Find details about China MP-06503, Thermal Clad from Bergquist Aluminium PCB / Printed Circuit Board / Metal Core Board Thermal Clad MP-06503

Model NO.
MP-06503
Type
Rigid Circuit Board
Dielectric
CEM-3
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Fexible
Processing Technology
Electrolytic Foil
Base Material
Aluminum
Insulation Materials
Epoxy Resin
Thermal Conductivity
2.4W/M-K
Dielectric Thickness
0.003" (76 µm)

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