Products

FPC Board for LED Manufacturing

China FPC Board for LED Manufacturing, Find details about China PCB, PCBA from FPC Board for LED Manufacturing

Model NO.
UC-4574
Processing Technology
Electrolytic Foil
Base Material
Pi
Insulation Materials
Epoxy Resin
Brand
Uc
Base Material Type
Polyimide
Thickness
0.15-0.2mm
Size
500*8mm
Finished Copper Thickness
1 Oz
Solder Mask Color
White/Black
Surface Treatment
HASL Lead Free/OPS/Immersion Gold
Ipc Standards
Ipc Class II
Lead Time
9 Working Days
Trademark
UC
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO. RoHs, TS, SGS
Origin
Shenzhen, China
HS Code
8534009000
Model NO.
UC-4574
Processing Technology
Electrolytic Foil
Base Material
Pi
Insulation Materials
Epoxy Resin
Brand
Uc
Base Material Type
Polyimide
Thickness
0.15-0.2mm
Size
500*8mm
Finished Copper Thickness
1 Oz
Solder Mask Color
White/Black
Surface Treatment
HASL Lead Free/OPS/Immersion Gold
Ipc Standards
Ipc Class II
Lead Time
9 Working Days
Trademark
UC
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO. RoHs, TS, SGS
Origin
Shenzhen, China
HS Code
8534009000
                                                     Ucreate LTD PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
 

1.Products Application

FPC Board for LED Manufacturing

 

2. Market Distribution
 
FPC Board for LED Manufacturing
 
 
3.Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control		±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness		 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist
 		0.75% 
 
4.Products Equipment

    FPC Board for LED Manufacturing

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