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5.0 Wmk CPU Thermal Gap Filler Laptop GPU Thermal Pad CPU Thermal Pads GPU Thermal Gap Filler

China 5.0 Wmk CPU Thermal Gap Filler Laptop GPU Thermal Pad CPU Thermal Pads GPU Thermal Gap Filler, Find details about China Themally Conductive Silicone Interface P, Heat Transfer Pad from 5.0 Wmk CPU Thermal Gap Filler Laptop GPU Thermal Pad CPU Thermal Pads GPU Thermal Gap Filler

Model NO.
HWP-500
Application
Insulators
Type
Insulation Film
Chemistry
Inorganic Insulation
Material
Silicone
Thermal Rating
250 250
Certification
CE RoHS EMC LVD
Color
White, Blue, Grey, Black
Brand
Honeywon
Density
1.5~2.0g/cm3
Flame Rate
94 V-0
Thermal Conductivity
0.8~5.0 W/Mk
Trademark
Honeywon
Origin
Guangdong, China

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