Products

Bluetooth Leadsintec Electronics Assembly
Bluetooth Leadsintec Electronics Assembly

Bluetooth Leadsintec Electronics Assembly

China Bluetooth Leadsintec Electronics Assembly, Find details about China Electronics, Electronics Assembly from Bluetooth Leadsintec Electronics Assembly

Model NO.
QXT-1238
Metal Coating
Copper
Mode of Production
SMT
Base Material
FR-4
Basic Material
Fr-1 Fr-2 Fr-3 Fr-4 Fr-5 Fr-6 G-10 Cem-1 Cem-2
Copper Thickness
0.5oz, 1oz, 2oz, 3oz, 4oz
Board Thickness
2.8mm
Min. Hole Size
0.24mm
Min. Line Width
0.1mm
Min. Line Spacing
0.1mm
Surface Finishing
HASL, OSP, Immersion Au, Sn, AG
Electrical Strength Defense
1.5n/Mm
Flammability Class
94V-0
Type
Electronics Assembly
Trademark
Leadsintec
Specification
CE RoHS SGS GMP
Origin
Shenzhen China(Mainland)

You Might Also Like