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High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate

China High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate, Find details about China High Thermal Conductivity Aln Ceramic, Aluminium Nitride Ceramic from High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate

Model NO.
TC-027
Classification
Organic Insulating Material
Certification
ISO9001
Color
Brown
Brand
Karefonte
Breakdown Voltage Strength
18.45kv/mm
Volume Density
3.335 g/cm3
Hardness
>=88hra
Bending Strength
382.7 g/cm3
Thermal Conductivity
180~210W/M.K
Temp Resistance
1780-1880 C
Shape
Customize
Thickness
0.635,1.0,Customize
Sizes
20*25mm,17*22mm,22*28mm,14*20mm,Customize
Usage
High Power Devices
Name
Aluminum Ntride Ceramic
Trademark
JRFT
Transport Package
OPP Bag, Carton
Specification
customize
Origin
Shen Zhen
HS Code
193915
Model NO.
TC-027
Classification
Organic Insulating Material
Certification
ISO9001
Color
Brown
Brand
Karefonte
Breakdown Voltage Strength
18.45kv/mm
Volume Density
3.335 g/cm3
Hardness
>=88hra
Bending Strength
382.7 g/cm3
Thermal Conductivity
180~210W/M.K
Temp Resistance
1780-1880 C
Shape
Customize
Thickness
0.635,1.0,Customize
Sizes
20*25mm,17*22mm,22*28mm,14*20mm,Customize
Usage
High Power Devices
Name
Aluminum Ntride Ceramic
Trademark
JRFT
Transport Package
OPP Bag, Carton
Specification
customize
Origin
Shen Zhen
HS Code
193915
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate
Product Introduction
Aluminum nitride ceramic substrate, high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical resistance, high resistivity , low dielectric loss, is the ideal LSI heat dissipation board and packaging materials.
ALN ceramics use heat resistant melt erosion and thermal shock resistance, can produce GaAs crystal crucible, Al evaporation pan, MHD power generation equipment and high temperature turbine corrosion resistant parts, using its optical properties can be used as an infrared window.
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate

Aluminum Nitride (ALN) is a ceramic material with outstanding properties such as high thermal conductivity and high electrical resistance. In addition, it is featured with advantages such as high hardness, corrosion resistant, low dielectric loss and low CTE.

It is widely used in the semiconductor, electronics, electrical and other industries. 

Feature:
1.High hardness , diversity                                    2. High precision and density
3.High reliability and stability                                4. High thermal conductivity
5.Extremely abrasive resistance performance    6. Wide scope of application
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate
 
PROPERTIES  PARAMETERS
Test Item/UnitNumerical ValueTest Item/UnitNumerical Value
MaterialAINAINAl2O3MaterialAINAINAl2O3
Volume Density (g/cm3)3.3353.323.6Volume Resistance (Ω.cm)1.4×10141.4×10131.4×1014
Thermal Shock ResistanceNone CrackBending Strength (Mpa)382.7335380
Chemical Stability (mg/cm3)0.970.970.97Thermal Expansivity        (/ºC,5ºC/min,20~300ºC)2.805×10.62.805×10.66.9×10.6
Breakdown Voltage Strength(kv/mm)18.4518.4515Roughness Ra(μm)0.3~0.50.3~0.50.2~0.4
Dielectric Constant (1MHz)8.568.569.5Thermal Conductivity(W/m-k)180~190190~21020
ColorDark GrayDark GrayWhiteVarpage (length‰)≤2‰≤2‰Class
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate
Application
1.Heat sinks & heat spreaders                    2.Electrical insulators for lasers
3.Chucks, clamp rings for semiconductor processing equipment
4.Electrical insulators                                   5.Silicon wafer handling and processing
6.Substrates & insulators for microelectronic devices & opto electronic devices
7.Substrates for electronic packages         8.Chip carriers for sensors and detectors
9.Chiplet                 10.Collet                       11.Laser heat management components
12.Molten metal fixtures                             13.Packages for microwave devices
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate
Regular size
TO-220, 1mm*14mm*20mm
TO - 3P, 1mm*20mm*25mm
TO-264, 1mm*22mm*28mm
TO-247, 0.635mm*17mm*22mm
0.38mm*114mm*114mm              0.5mm*114mm*114mm
0.635mm*114mm*114mm            1mm*114mm*114mm
0.635mm*120mm*120mm           0.5mm*120mm*120mm
1mm*120mm*120mm                 1.5mm*120mm*120mm
Non-standard products , please contact us to provide drawings of your products.
welcome drawings processing customized zirconia /alumina / aluminum nitride .
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate
Our services
Online Services:24 hours,Inquiry reply within fastest.
Well- Trained & Experienced Staff are to answer all your requirements.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Sample Order delivered within 24 hours.
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate
FAQ
Q:Can we get the sample? If can , how to get it ?A:Yes , we can offer you the free sample if have in stock , but not include the shipping cost . Please feel free to contact to our sales if you need the sample. 
 
Q:How can you guarantee the quality ?
A:With advanced professional machine and testing equipment,we ensure 100 % quality before shipment.
 
Q: Can we OEM or according to our requirement to cut the size ?
A:We are a China Manufacture specialized in the thermal insulation materials, for example,Silicone Rubber pad,Thermal tape,Thermal Grease,Silicone Cloth with more than 11 years old.
 
Q:What payment term is available?
A:Bank transfer , Paypal , Western Union , Master Card , VISA .
High Thermal Conductivity Aln Ceramic Aluminium Nitride Ceramic Substrate
Any question or want to know,please contact to me !!!

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