LP16-400DF, a kind of polymer resettable fuse is made of polymer materials with conductivity, thus the rated current is produced. If the current through the fuse is too high, its temperature will continue to rise, at the same time polymer material will swell, causing the resistance to rise, thus the current in the circuit is reduced effectively. The fuse will return to its original state to ensure the normal use of the circuit when the fault is removed. The fuse can play the role of a general fuse in electrical properties. Hence in many cases such kind of resettable fuse already replaced the conventional fuse.
 
Features                                                                Customized size and electrical characteristic availableRadial-leaded devices for wave-soldering or manually assemblyFast tripping resettable circuit protection                                             
Product Dimensions For Radial-leaded Devices                                              
Unit: mm
  
   
 

Thermal Derating Chart-IH(A)                                           
Electrical Characteristics at 25ºC                                       
IH=Hold current: maximum current at which the device will not trip at 25ºC still air.
IT=Trip current: minimum current at which the device will always trip at 25ºC still air.
Vmax=Maximum voltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Ttrip=Maximum time to trip at assigned current.
Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.
Rmin=Minimum device resistance at 25ºC prior to tripping.
R1max=Maximum device resistance measured after 1 hour post one-time trip.

Part Numbering System                                                       

  
 
 

Test Procedures And Requirements                                                 
  
 
Application Requirements                                                            
Soldering recommendation:
* Methods: IR, Vapor phase oven, hot air oven, wave solder, soldering temperature should not exceed GB-T2423 request.
* Devices can be cleaned using standard industry methods and solvents.
Notes:
If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Storage:
The maximum ambient temperature shall not exceed 40ºC. Storage temperatures higher than 40ºC could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 70%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.
Warning:
PPTC devices are intended for protection against occasional over-current or over-temperature fault conditions, and should not be used when repeated fault conditions are anticipated. Operation beyond maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
Notes:
The specification is intended to present application, product and technical data to assist the user in selecting PPTC circuit production devices. However, users should independently evaluate and test the suitability of each product. Wayon makes no warranties as to the accuracy or completeness of the information and disclaims any liability resulting from its use. Wayon's only obligations are those in the Wayon Standard Terms and Conditions of Sale and in no case will Wayon be liable for any incidental, indirect, or consequential damages arising from the sale, resale, or misuse of its products. Wayon reserves the right to change or update, without notice, any information contained in this specification.