Desoldering Worktable BGA900-IR

China Desoldering Worktable BGA900-IR, Find details about China BGA, BGA Rework from Desoldering Worktable BGA900-IR

Basic Info.

Model NO.

BGA900

Welding Turning Rolls Type

Adjustable

Condition

New

Max Mounting BGA Siz

≤ 20mm X20mm

Min Mounting BGA Size

3.5× 3.5mm

Power

200W

Power Supply

220V, 50Hz

Net Weight

15kg

Dimension

400 * 550 * 430mm

Trademark

Torch

Transport Package

Wooden Case

Specification

400 * 550 * 430mm

Origin

Beijing, China

HS Code

8514200009

Model NO.

BGA900

Welding Turning Rolls Type

Adjustable

Condition

New

Max Mounting BGA Siz

≤ 20mm X20mm

Min Mounting BGA Size

3.5× 3.5mm

Power

200W

Power Supply

220V, 50Hz

Net Weight

15kg

Dimension

400 * 550 * 430mm

Trademark

Torch

Transport Package

Wooden Case

Specification

400 * 550 * 430mm

Origin

Beijing, China

HS Code

8514200009

Product Desciption

Desoldering worktable BGA900-IR

Introduction:
The desoldering worktable BGA900-IR is manufactured by our company which is heating by infrared ray in double-sided, can heat from the top and preheat at the bottom. Suit to welding, removal or repair BGA, PBGA, CSP and variety of packages, can meet the multi-layer PCB substrate and unleaded welding requirements. Configuration can be completed on the planting table BGA to plant the ball. The device repair wilding's mainly target is motherboards and graphics chip BGA of PC, desktops, switches, XBOX (including graphics chip, video card etc).

Features of BGA900:

Double infrared ray heating systems, can heating at the top of the components and the bottom of PCB at the same time, compared with the Cyclones, the heating process is more stable and avoid uneven heating of the PCB which can cause warp; the use of advanced infrared heating methods needn't replace the heating nozzle, this also save the cost of investment.
Advanced temperature system: Independent heating from top to bottom and also independent temperature control, welding finished with the alarm function, all this characteristics can be more convenient and comfortable.
Fashionable appearance: black full design, arc top heater, small size, and could be placed in a 400MM room.
Chip oriention: Red laser BGA chips center orientation is easy to operate.
Large area heating and preheating system: Top heating 80×80MM,bottom heating 200×200MM. It could be easy to deal with heavy thermal capacity PCB and other lead-free soldering.
Integrative design: All-purpose orientation bracket and PING could achieve sustainment and fixation of big size PCB. So, it is easy to prevent and rectify some transformable mainboard, to fix up the PCB board and ensure the success of maintainment.
Economical investment: Fully considered the reality of common maintain department, not only cut off the cost, but also ensure the quality.
More users: small cubage, large warm-up area, very suit to computer mainboard, notebook PC, and individual maintain department. It is convenient to transport and convey.

Specification:

Specification
Heat	infrared heating from top and bottom
Dimension	L400mm * W350mm * H410mm
Weight	About 15kg
Bracket	It is decided by customers' request.
Packing	It is decided by customers' request.
Packed weight	About 17kg
Electric parameters
Input power	AC 220V 50Hz
Top heat	IR heating
Top heating size	80mm* 80mm
Top heating power	300W
Bottom heating	IR heating
Bottom heating size	200mm* 200mm
Bottom heating power	600W
Total power	900W
Temperature controlling
top heating controlling	Temperature controlling independently, high precision close loop controlling, error of the panel is 0.5%
top temperature measurement	High sensitive K temperature sensor, monitoring temperature directly
Bottom heating controlling	Temperature controlling independently, high precision close loop controlling, error of the panel is 0.5%, with alarm.
Bottom temperature measurement	High sensitive K temperature sensor, monitoring temperature directly
Repairing function
Application	For soldering, unsoldering, repairing BGA QFP CSP and semi conductors.