High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin

China High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin, Find details about China Adhesive, Metal Liquid Resin from High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin

Method
Brush
Drying Method
Heat Curing
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Substrate
Ceramic
Components
Epoxy
Application
Metal, Ceramic, Glass, Fiber, Wood, Electronic COM
Another Name
Electrician Epoxy Resin
Advantage
Suitable High Temperature Climate
Package
Bottle
MOQ
15kg
Viscosity
1500cps
Classification
Two-Component Adhesive
Material
Pure Epoxy Resin
Certificate
SGS
Use Range
Electronic Components Ceramic Metal Fiber Glass Wo
Operating Temperature
200 Degrees
Trademark
Boqiao
Transport Package
Bottle
Origin
Guangdong, China
HS Code
3506912000
Method
Brush
Drying Method
Heat Curing
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Substrate
Ceramic
Components
Epoxy
Application
Metal, Ceramic, Glass, Fiber, Wood, Electronic COM
Another Name
Electrician Epoxy Resin
Advantage
Suitable High Temperature Climate
Package
Bottle
MOQ
15kg
Viscosity
1500cps
Classification
Two-Component Adhesive
Material
Pure Epoxy Resin
Certificate
SGS
Use Range
Electronic Components Ceramic Metal Fiber Glass Wo
Operating Temperature
200 Degrees
Trademark
Boqiao
Transport Package
Bottle
Origin
Guangdong, China
HS Code
3506912000
 
Port
Guangzhou
Lead Time:
Quantity(Kilograms)1 - 10000>10000
Est. Time(days)15To be negotiated

 
Performance before curing
PerformanceunitGlue AGlue B
Exterior---Colorless transparent liquidColorless, light yellow, liquid
density25ºC,g/cm31.05-1.080.92-1.02
Viscosity25ºC,mPa.s7000-8500100-400
It is recommended to wear protective equipment such as gloves, masks and goggles during use. In order to achieve the best performance of the product, prepare weighing during use.
 
Performance after curing
projectunitMeasurements
hardnessSHORE-D90±3
Volume resistivity25ºC,Ω.cm>1.35*1015
Surface resistivity25ºC,Ω>1.2*1014
Dielectric strength25ºC,Kv/mm>25
Dielectric constant----4.80-5.30
Dielectric lossτδ0.03-0.05
Tensile StrengthMPa55-77
Bending strengthMPa95-110
Glass transition temperatureºC100-110

Note: The above performance data is based on standard curing process testing and is for customer reference only. It cannot be fully guaranteed that all the above data will be achieved in a specific environment. Please refer to the actual measured data when using it.


About potting

Ratio: A:B=100:80 (note that the weight ratio is not the volume ratio)
A/B is a two-component epoxy system with low viscosity, good fluidity, and good leveling. It has the following characteristics:
1. This product is transparent and slightly yellow, full transparent color, epoxy potting glue, low viscosity, good fluidity, and easy to penetrate into the gap of the product.
2. No curing at room temperature, early stage: heating at 80-90 degrees, 2-3 hours, late stage: 100-115 degrees, curing for 3-5 hours.
3. No bubbles after curing, smooth surface, good gloss, high pressure resistance, high temperature resistance and high hardness.

 
Four characteristics are waiting for you

High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation ResinHigh Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation ResinHigh Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation ResinHigh Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin
 
 
 

 
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High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin
High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin
High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin
High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation ResinHigh Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin
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High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin

High Temperature Resistant Resin Adhesive, Good Crack Resistance, Pressure Resistant and High Temperature Resistant Encapsulation Resin