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Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin

China Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin, Find details about China Adhesive, Epoxy Resin from Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin

Method
Brush
Level
Finish Coat
Drying Method
Heat Curing
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Components
Epoxy
Formation Mechanism
Conversion Type
Application
Epoxy Adhesive Potting Glue
Another Name
Epoxy Adhesive
Advantage
Suitable High Temperate Climates
Package
Bottle
MOQ
20kg
Classification
Double Components Adhesives
Usage
Electronic Components, Metals, Cement Products, Wo
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Viscosity
20000
Adhesive Material
Metal, Fiber, Electronic Components
Operating Temperature
180
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
Method
Brush
Level
Finish Coat
Drying Method
Heat Curing
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Components
Epoxy
Formation Mechanism
Conversion Type
Application
Epoxy Adhesive Potting Glue
Another Name
Epoxy Adhesive
Advantage
Suitable High Temperate Climates
Package
Bottle
MOQ
20kg
Classification
Double Components Adhesives
Usage
Electronic Components, Metals, Cement Products, Wo
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Viscosity
20000
Adhesive Material
Metal, Fiber, Electronic Components
Operating Temperature
180
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin 
Packaging & Delivery
Port
Guangzhou
Lead Time:
Quantity(Kilograms)1 - 10000>10000
Est. Time(days)15To be negotiated


 
Basic information of the product

Performance after curing
projectunitParameter valueDetection method
Exterior-------black-------
proportiong/cm31.7-1.8-------
ViscosityCPS3-4*105-------
hardnessShore-D82±3-------
Water absorption%(24h)<0.1-------
tensile strengthKg/cm212-14-------
Withstand voltageKv/mm12-14-------
Heat distortion temperature0.45MPa/ºC155-------
Curing time 
Curing time2H at 115ºC or 1.5h at 120ºC
1h first drying, 2h hardening


Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone ResinResistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin
 
 



 
 


Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone ResinResistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin

 
    Packing

Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin
Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin
Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin
Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone ResinResistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin
Other product
 
Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin

Resistance to Cold and Heat Shock, Strong Bonding Strength, Electronic Ceramic Potting and Bonding Silicone Resin



 

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