Products

Blind Via PCB Built on 32 Layer with Non-Conductive Via Fill

China Blind Via PCB Built on 32 Layer with Non-Conductive Via Fill, Find details about China Blind Via PCB, MCPCB from Blind Via PCB Built on 32 Layer with Non-Conductive Via Fill

Model NO.
BIC-0482-V1.2
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Enig
Base Material
Copper Clad Laminate
Insulation Materials
Epoxy Resin
Brand
Bicheng
Trademark
Bicheng
Transport Package
Vacuum
Specification
98 X 76mm
Origin
China
HS Code
8534009000

You Might Also Like