Microwave PCB Built on 20 Layer with Thermal Stress Test
China Microwave PCB Built on 20 Layer with Thermal Stress Test, Find details about China Prototype, Hybrid PCB from Microwave PCB Built on 20 Layer with Thermal Stress Test
Basic Info.
Model NO.
BIC-GS-0672-V2.0
Type
Rigid Circuit Board
Dielectric
Hydrocarbon/Ceramic
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
HASL Lf
Base Material
Copper Clad Laminate
Insulation Materials
Epoxy Resin
Brand
Bicheng
Trademark
Bicheng
Transport Package
Specification
86 X 61mm
Origin
China
HS Code
8534009000
Product Desciption
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