Products

Multilayer PCB Built Blind Via Outer Layer to Inner Layer

China Multilayer PCB Built Blind Via Outer Layer to Inner Layer, Find details about China PCB Board, PCB Circuit Board from Multilayer PCB Built Blind Via Outer Layer to Inner Layer

Model NO.
BIC-891-V8.91
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
1.6mm
Surface Finish
Immersion Gold
out Layer Copper
1 Oz
Soldermask Color
Green
Silkscreen Color
White
Final Foil Internal
1 Oz
Minimum Trace and Space
4 Mil / 4 Mil
Minimum / Maximum Holes
0.3 mm /3.5 mm
Via
Minimum Size 0.3mm. Blind Via
Test
100% Electrical Test
Trademark
Bicheng Enterprise Limited
Transport Package
Vacuum
Specification
119mm x 80mm =1pcs
Origin
China
HS Code
8534009000

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