for Electroplating of Circuit Boards CAS 1317 -38-0 Superfine Copper Oxide Cuo with Factory Price

China for Electroplating of Circuit Boards CAS 1317-38-0 Superfine Copper Oxide Cuo with Factory Price, Find details about China Copper Oxide, Cuo from for Electroplating of Circuit Boards CAS 1317-38-0 Superfine Copper Oxide Cuo with Factory Price

Basic Info.

Model NO.

FITECH-CuO

Quality

First Class

Usage

Glass, Enamel, Ceramics

Molecular Weight

79.545

Sample

Avaiable

Shape,Figure

Powder

Trademark

FITECH

Transport Package

25 Kilograms Bag

Specification

98%min

Origin

China

HS Code

811221000

Model NO.

FITECH-CuO

Quality

First Class

Usage

Glass, Enamel, Ceramics

Molecular Weight

79.545

Sample

Avaiable

Shape,Figure

Powder

Trademark

FITECH

Transport Package

25 Kilograms Bag

Specification

98%min

Origin

China

HS Code

811221000

Product Desciption

Product Description

Copper oxide

1.Molecular formula: CuO

2.Molecular weight: 79.545

3.Melting point: 1326°C

4.Properties: Slight hygroscopicity

5.Storage: Store in dry warehouse. Keep away from damp and store away from strong acids and edible materials. Handle with care during loading and unloading to prevent package damage.

Copper oxide is black or brown-black powder, slightly hygroscopic. Density 6.3-6.9g/cm3, melting point 1326ºC, insoluble in water and alcohol, soluble in acid, ammonium chloride, potassium cyanide solution and ammonia solution.

Product name	Copper oxide
CAS No	1317-38-0
Color	Black
Purity	98%min
Shape	Powder
Material	CuO
Melting point	1326ºC

Applications

1.Active copper oxide is mainly used for circuit board electroplating. Industrial grade copper oxide is mainly used as colorant for glass, enamel, ceramics, etc. And raw material for magnetic materials, used in the manufacture of fireworks, dyes, catalysts, and other copper salts, also used in the rayon industry, can also be used as anti-wrinkle agent for paint and electronic industry, etc.

2.The electroplating grade active copper oxide is mainly used for electroplating of circuit boards, preparing high-end catalysts and other fine copper salts.