PCB Assembly Manufacturer Access Control Circuit Board PCB and Turnkey OEM PCBA Service
China PCB Assembly Manufacturer Access Control Circuit Board PCB and Turnkey OEM PCBA Service, Find details about China Pcb, Pcb Board from PCB Assembly Manufacturer Access Control Circuit Board PCB and Turnkey OEM PCBA Service
Basic Info.
Model NO.
okey
Production Process
Semi-Additive Process
Base Material
Aluminum
Insulation Materials
Organic Resin
Engineer Service
Copy PCB Gerber File
Order Acceptable
Sample Order and Small Order Are Welcome
Sales Service
24 Hours Online Service
Product Characteristics
with BGA
Trademark
OKEY
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
FR-4 1.6mm 2 layers PCB immersion gold or HASL
Origin
Shenzhen City, China
HS Code
8534001000
Model NO.
okey
Production Process
Semi-Additive Process
Base Material
Aluminum
Insulation Materials
Organic Resin
Engineer Service
Copy PCB Gerber File
Order Acceptable
Sample Order and Small Order Are Welcome
Sales Service
24 Hours Online Service
Product Characteristics
with BGA
Trademark
OKEY
Transport Package
Inner Vacuum Packed Outside in Carton
Specification
FR-4 1.6mm 2 layers PCB immersion gold or HASL
Origin
Shenzhen City, China
HS Code
8534001000
Product Desciption
| Technical Capabilities | |||
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Max. Board size | 2000×610mm | ||
Min. board Thickness | 2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1mm(4mil) | ||
| Max. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1mm(4mil) | ||
| Min. hole size | 0.2mm(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300V | ||
| Min. blind/buried via | 0.15mm (6mil) | ||
Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
Materials | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 08:01 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil | ||
| Finished thickness | |||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
Double Sided PCB with OEM Service
1. Reputable manufacturer
2. Certificate: ISO UL RoHS REACH
3. FR-4 PCB
4. Timely delivery
5. Reputable manufacturer
We can offer you all kinds of high quality PCB with fast delivery time and competitive price.
Our PCB sell well at Eurpe, America and Asia, passed UL ISO Certificates and meet RoHS, REACH standards. We have rich experience in PCB field to serve you needs.
Welcome to contact us for more details and talk further business.
Inquiries are typically answered within 24 hours.
Wish you all the best and prosperous business.
| NO | Item | Technical capabilities |
| 1 | Layers | 1-12 layers |
| 2 | Max. Board size | 2000× 610mm |
| 3 | Min. board Thickness | 2-layer 0.25mm |
| 4-layer 0.6mm | ||
| 6-layer 0.8mm | ||
| 8-layer 1.5mm | ||
| 10-layer 1.6~2.0mm | ||
| 4 | Min. line Width/Space | 0.15mm(4-5mil) |
| 5 | Max. Copper thickness | 10OZ |
| 6 | Min. S/M Pitch | 0.15mm(4-5mil) |
| 7 | Min. hole size | 0.25mm(8mil) |
| 8 | Hole dia. Tolerance (PTH) | ± 0.05mm(2mil) |
| 9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
| 10 | Hole position deviation | ± 0.05mm(2mil) |
| 11 | Outline tolerance | ± 0.10mm(4mil) |
| 12 | Twist & Bent | 0.75% |
| 13 | Insulation Resistance | > 10 12 Ω Normal |
| 14 | Electric strength | > 1.3kv/mm |
| 15 | S/M abrasion | > 6H |
| 16 | Thermal stress | 288° C10Sec |
| 17 | Test Voltage | 50-300V |
| 18 | Min. blind/buried via | 0.15mm (6mil) |
| 19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
| 20 | Materials | FR4, H-TG, Teflon, Rogers, Ceramics, Aluminium, Copper base |
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