China PCB Assembly Manufacturer Access Control Circuit Board PCB and Turnkey OEM PCBA Service, Find details about China Pcb, Pcb Board from PCB Assembly Manufacturer Access Control Circuit Board PCB and Turnkey OEM PCBA Service
Technical Capabilities | |||
Items | Speci. | Remark | |
Max panel size | 32" x 20.5"(800mm x 520mm) | ||
Max. Board size | 2000×610mm | ||
Min. board Thickness | 2-layer 0.15mm | ||
4-layer 0.4mm | |||
6-layer 0.6mm | |||
8-layer 1.5mm | |||
10-layer 1.6~2.0mm | |||
Min. line Width/Space | 0.1mm(4mil) | ||
Max. Copper thickness | 10OZ | ||
Min. S/M Pitch | 0.1mm(4mil) | ||
Min. hole size | 0.2mm(8mil) | ||
Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||
Hole position deviation | ±0.05mm(2mil) | ||
Outline tolerance | ±0.10mm(4mil) | ||
Twist & Bent | 0.75% | ||
Insulation Resistance | >10 12 Ω Normal | ||
Electric strength | >1.3kv/mm | ||
S/M abrasion | >6H | ||
Thermal stress | 288°C 10Sec | ||
Test Voltage | 50-300V | ||
Min. blind/buried via | 0.15mm (6mil) | ||
Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
Materials | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base | ||
Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
Inner copper thickness | 1~4 oz | ||
Outer copper thickness | 0.5~6 oz | ||
Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
±10% | ±10% | 6~8 L | |
±10% | ±10% | ≥10 L | |
Inner layer treatment | brown oxidation | ||
Layer count Capability | 1-30 LAYER | ||
alignment between ML | ±2mil | ||
Min drilling | 0.15 mm | ||
Min finished hole | 0.1 mm |
Hole precision | ±2 mil(±50 um) | ||
tolerance for Slot | ±3 mil(±75 um) | ||
tolerance for PTH | ±3 mil(±75um) | ||
tolerance for NPTH | ±2mil(±50um) | ||
Max Aspect Ratio for PTH | 08:01 | ||
Hole wall copper thickness | 15-50um | ||
Alignment of outer layers | 4mil/4mil | ||
Min trace width/space for outer layer | 4mil/4mil | ||
Tolerance of Etching | +/-10% | ||
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
at trace corner | ≥0.2mil(5um) | ||
On base material | ≤+1.2mil | ||
Finished thickness | |||
Hardness of solder mask | 6H | ||
Alignment of solder mask film | ±2mil(+/-50um) | ||
Min width of solder mask bridge | 4mil(100um) | ||
Max hole with solder plug | 0.5mm | ||
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
Max Nickel thickness for Gold finger | 280u"(7um) | ||
Max gold thickness for Gold finger | 30u"(0.75um) | ||
Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
bow and twist | 0.75% |
NO | Item | Technical capabilities |
1 | Layers | 1-12 layers |
2 | Max. Board size | 2000× 610mm |
3 | Min. board Thickness | 2-layer 0.25mm |
4-layer 0.6mm | ||
6-layer 0.8mm | ||
8-layer 1.5mm | ||
10-layer 1.6~2.0mm | ||
4 | Min. line Width/Space | 0.15mm(4-5mil) |
5 | Max. Copper thickness | 10OZ |
6 | Min. S/M Pitch | 0.15mm(4-5mil) |
7 | Min. hole size | 0.25mm(8mil) |
8 | Hole dia. Tolerance (PTH) | ± 0.05mm(2mil) |
9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
10 | Hole position deviation | ± 0.05mm(2mil) |
11 | Outline tolerance | ± 0.10mm(4mil) |
12 | Twist & Bent | 0.75% |
13 | Insulation Resistance | > 10 12 Ω Normal |
14 | Electric strength | > 1.3kv/mm |
15 | S/M abrasion | > 6H |
16 | Thermal stress | 288° C10Sec |
17 | Test Voltage | 50-300V |
18 | Min. blind/buried via | 0.15mm (6mil) |
19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 | Materials | FR4, H-TG, Teflon, Rogers, Ceramics, Aluminium, Copper base |