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Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm

China Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm, Find details about China Reballing Kit, Reball Fixture from Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm

Model NO.
705-0001168
Character
High Temperature Resistance
Production Process
CNC
Interface Type
N/a
Brand
Sireda
Package
BGA221
Pitch Size
0.5mm
IC Size
11.5X13X0.8mm
Material of Solder Kit
Al
BGA Reballing Service
Acceptable
Color
Red & Black
Trademark
Sireda
Specification
80*80mm
Origin
Shenzhen, China
Model NO.
705-0001168
Character
High Temperature Resistance
Production Process
CNC
Interface Type
N/a
Brand
Sireda
Package
BGA221
Pitch Size
0.5mm
IC Size
11.5X13X0.8mm
Material of Solder Kit
Al
BGA Reballing Service
Acceptable
Color
Red & Black
Trademark
Sireda
Specification
80*80mm
Origin
Shenzhen, China
1. Reball Tools
Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm


2. Re-balling process

1> Prepare IC to be re-balled;
 
2> Put an IC into IC Guide, take care of the A1 position;

3> Apply some solder paste to the Solder Paste Stencil;

4> Put Solder Paste Stencil onto IC Guide (already with a de-soldered & cleaned IC);

5> Use Solder Paste Blade to apply solder paste onto IC pads;

6> Remove Solder Paste Stencil from IC Guide;

7> Put some solder balls to Solder Ball Stencil;

8> Put Solder Ball Stencil onto IC Guide;

9>  Use Solder Ball Blade to gently press solder ball onto IC pads;

10> Take away the Solder Ball Stencil, and take out the Re-balled IC;

11> Put the re-balled IC to Reflow Oven or other Heating Device for soldering.



3. Rework Service

   1> Focus on precision BGA
           
Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm
Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm



    2> Features

      1. RoHS compliant
      2. Reasonable temperature curve ensure good reball
      3. ESD protection
      4. Residual tin in pad recess can be removed perfectly
      5. skilled technicians and mature process
      6. Our individual design of Reball kits & fixtures
 
Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm


4. Rework Process

Semiconductor Basic Rework Process
Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm


5. Relative Products
Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.
Part NumberDescriptionPackage
705-0001162BGA100 1.0mm eMMC 14x18x1mm C80 RDBKBGA100
705-0001163BGA136 0.5mm eMCP 10x10x0.8mm C80 RDBKBGA136
705-0001164BGA153 0.5mm eMMC 11.5x13x0.8mm C80 RDBKBGA153
705-0001165BGA169 0.5mm eMMC 12x16x0.8mm C80 RDBKBGA169
705-0001166BGA162 0.5mm eMCP 11.5x13x1mm C80 RDBKBGA162
705-0001167BGA186 0.5mm eMCP 12x16x1mm C80 RDBKBGA186
705-0001168BGA221 0.5mm eMCP 11.5x13x1mm C80 RDBKBGA221
705-0001169BGA254 0.5mm eMCP 11.5x13x0.7mm C80 RDBKBGA254
705-0001170BGA280 0.45mm eMCP 14x14.5x0.8mm C80 RDBKBGA280
705-0001171BGA529 0.5mm eMCP 15x15x0.7mm C80 RDBKBGA529


 
Company Profile

Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mmSireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.


Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
 
Certifications

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm

Sireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.
 
Our Advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.
 
Our Exhibition and Customers

Individually Designed Reballing Kits for BGA221 Emcp IC Chip 11.5X13X1mm


 

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