Products

Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, Wlcsp

China Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, Wlcsp, Find details about China Test Socket, Burn in Socket from Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, Wlcsp

Model NO.
701-0000000
Package
BGA, LGA, Qfn, Wlcsp
Contact
Spring Probe
Trademark
Sireda
Transport Package
Carton Box
Specification
Burn in Socket
Origin
Shenzhen, China
HS Code
8536690000
Model NO.
701-0000000
Package
BGA, LGA, Qfn, Wlcsp
Contact
Spring Probe
Trademark
Sireda
Transport Package
Carton Box
Specification
Burn in Socket
Origin
Shenzhen, China
HS Code
8536690000
Mold Socket for semeconductor test Socket, Burn in Socket, Programming Socket for eMMC, eMCP, Memory, NAND, Power IC with package of BGA, LGA, QFN, WLCSP.
- Compact size of the socket design, help to save space for burn in test.
- High cost effective socket for IC chip production test or validation.
- Suitable for eMMC, eMCP, Nand, Memory, Power IC, MEMS IC, etc.
- Suitable for different kind of package like BGA, LGA, QFN, WLCSP, etc.
- Support for PCB design and manufacturing.
- Provide customized design for customer's requirement.
Product Parameters
 Mechanical 
Material Socket BodyPEI
ContactPogo Pin
Operation Temperature-40 ~ 120 ºC
Life Span50K Cycles
Spring Force20g ~ 30g per Pin

Electrical
Current RatingMin. 1.2A 
DC ResistanceMax. 100mΩ

We provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have a look at our website: siredatech.en.made-in-china.com. 
Company Profile

Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, Wlcsp

Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.

Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
 
Certifications

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, WlcspSireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.
Our Advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.
 
Our Exhibition and Customers

Test Socket, Burn in Socket, Programming for Emmc, Emcp, Memory, Nand, Power IC with Package of BGA, LGA, Qfn, Wlcsp




 

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