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HDI High Tg170-180 Multilayer Buried and Blind Via Holes PCB

China HDI High Tg170-180 Multilayer Buried and Blind Via Holes PCB, Find details about China PCB, PCB Board from HDI High Tg170-180 Multilayer Buried and Blind Via Holes PCB

Metal Coating
Gold
Layers
Multilayer
Base Material
FR-4
Certification
RoHS, ISO, UL
Customized
Customized
Condition
New
Model No
HDI PCB
Service
7*24 Hours Online
Technology
Lead The Industry
Processing Technology
Electrolytic Foil
Insulation Materials
Epoxy Resin
Delivery
3days
Price
Factory Price
Type
Rigid Circuit Board
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Brand Material
Kb/Shengyi/Iteq/Rogers/Isola/Teflon and F4b
Board Thickness
0.4-3.2mm
Min. Line Width
0.20mm
Transport Package
Customized Packaging According to Product
Origin
Shenzhen, China
HS Code
8534009000

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