China SMD Heatsink Reflow Oven for Heatsink Production Line, Find details about China Solder Reflow Oven, SMD Reflow Oven from SMD Heatsink Reflow Oven for Heatsink Production Line
S - Standard, O - Option, M - Manual, A - Auto, N/A - Not Availible) | |||
Specifications | A500 | A600 | A800 |
Dimension(L*W*H)mm | 3100X720X1250 | 3600X760X1340 | 4210X830X1340 |
Standard Color | Computer Grey | ||
Weight | Approx.350KG | Approx.420KG | Approx 800KG |
Number Of Heating Zones | Up5/Bottom5 | Up6/Bottom6 | Up8/Bottom8 |
Length Of Heating Zones | 1900mm | 2300mm | 2600mm |
Heating pattern | Up:Hot air,Bottom:Infared | ||
Number of Cooling Zones | 1 | ||
Length Of Cooling Zones | 300mm | ||
Exhaust Volume | 10M3/minx2 Exhausts | ||
Control System | Instrument(S) | Instrument(S) | Instrument/PLC+Computer |
Electric Supply Required | N/A | N/A | Lenovo |
Power For Warm Up | Standard | Standard | Standard |
Power Consumption | 3phase,380V 50/60Hz | ||
Warming Time | Approx.25 minute | ||
Temp. Setting Range | Room Temp.-- 300 degree | ||
Temperature Control Method PID + SSR | S | ||
Temperature Control Precision | ± 1.0 degree | ||
Temperature Deviation on PCB | ± 1.5 degree | ||
Commutated Element | Plate | Plate | Aluminium Alloy Plate |
Process Data & Status Storage | N/A | N/A | Standard |
Temperature Alarm | Standard | ||
Board Dropped Alarm | N/A | ||
Electrical SMEMA Interface | N/A | ||
Rail Number | N/A | ||
Max.Width Of PCB | 300mm | ||
Components Clearance | Top/ Bottom is 20mm | ||
Converyor Direction | L→R/R→L | ||
Transmission Agent | Mesh | ||
Center Support | N/A | ||
Converyor Height | 900+/-20mm | ||
Converyor Speed Range | 300~2000mm/min | ||
Lubrication Auto-Afflux | N/A | ||
Ups | Standard | ||
Temp. Thermocouple Slot | Standard | ||
Cooling Method | Air fan | ||
Oxygen | N/A |