Applications:
1.ITO conductive glass
2.Electronic, electrical appliances
3.Flexible board (FPC)
4.Insulating thermal conduction semiconductor
5.Thermal conductive film, ACF heat pressing engineering
6.Thermistors and temperature sensors



Material Composition
Silicone rubber, fiberglass cloth etc.
High performance nano materials and heat conduction materials


Features
1. Thermal resistance: 0.63ºC-in/2W
2. Low fastening pressure
3. Surface smooth and highly adapted
4. Electrical insulation


ACF Silicone Bonding Tape
BM500 used in various types of display screen hot-press binding technology, put it on the bottom surface of thermal head , have a buffer effect on temperature, so that the temperature is uniform,  isolation hot pressed products in direct contact with the thermal head, also has to prevent isolation protective effect of electrostatic leakage.


Physical Properties