China Quality Assurance PCBA for Industrial Machine Shenzhen Factory Fr4 PCBA Assembly for Mobile Phone Motherboard with DIP, Find details about China PCBA Assembly, PCBA SMT from Quality Assurance PCBA for Industrial Machine Shenzhen Factory Fr4 PCBA Assembly for Mobile Phone Motherboard with DIP
Technology | SMT, DIP |
SMT capability | 2,000,000 points per day |
DIP capability | 300,000 points per day |
Experiences | QFP, BGA, μBGA, CBGA |
Process | Lead-free |
Programming | Yes |
Conformal coating | Yes |
Layer count | 1-48 layers |
Material | fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,teflon,rogers,nelco |
Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz |
Board thickness | 8-236mil(0.2-6.0mm) |
Min.line width/space | 3/3 mil(75/75um) |
Min. drill size | 8 mil(0.2mm) |
Min. HDI laser drill size | 3 mil(0.067mm) |
Tolerance of hole size | 2 mil(0.05mm) |
PTH copper thickness | 1 mil(25 um) |
Solder mask color | Green,blue,yellow,white,black,red |
Peelable solder mask | yes |
surface treating | HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold,gold finger |
Gold thickness | 2-30u" (0.05-0.76um) |
Blind hole/buried hole | yes |
V-cut | yes |