Technology | SMT, DIP |
SMT capability | 2,000,000 points per day |
DIP capability | 300,000 points per day |
Experiences | QFP, BGA, μBGA, CBGA |
Process | Lead-free |
Programming | Yes |
Conformal coating | Yes |
Layer count | 1-48 layers |
Material | fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,teflon,rogers,nelco |
Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz |
Board thickness | 8-236mil(0.2-6.0mm) |
Min.line width/space | 3/3 mil(75/75um) |
Min. drill size | 8 mil(0.2mm) |
Min. HDI laser drill size | 3 mil(0.067mm) |
Tolerance of hole size | 2 mil(0.05mm) |
PTH copper thickness | 1 mil(25 um) |
Solder mask color | Green,blue,yellow,white,black,red |
Peelable solder mask | yes |
surface treating | HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold,gold finger |
Gold thickness | 2-30u" (0.05-0.76um) |
Blind hole/buried hole | yes |
V-cut | yes |