Diamond Metal Bond Grinding Segment for Floor Surface

China Diamond Metal Bond Grinding Segment for Floor Surface, Find details about China Diamond Grinding Plate, HTC Grinding Plates from Diamond Metal Bond Grinding Segment for Floor Surface

Model NO.
BSD
Trademark
BSD
Specification
12
Origin
China
HS Code
8207
Model NO.
BSD
Trademark
BSD
Specification
12
Origin
China
HS Code
8207

Diamond Metal Bond Grinding Segment for Floor Surface

6# 16# 36# 60# Aggrasivev HTC Metal Bond Segment Diamond Abrasive Grinding Polishing Pad  For Granite concrete floor Surface Grinder

1. Grinding  segments  are  used for grinding concrete, terrazzo, stone floors .  welded on metal  plate, fixed on Multi-functional floor grinding machine and stone refurbished machine . 

2. When grinding hard concrete ,diamond segment bond needs to match the concrete hardness  .

3. Grits: 6# - 400#

4. Size of segment:  Dia.20*10mm, Dia.25.4*8mm, Dia.25.4*10mm , 2 segments

5. Major market: USA, Canada, Austrialia,  Iran, Turkey, Jordan, Vietnam, China, etc.  

6. 100% produced in our own factories,

Our Metal Bond Discs are specially designed for polishing and grinding concrete, granite, marble, limestone, travertine and terrazzo, 

 

 For  Concrete, stone and terrazzo
  Segment Height  10mm
  Grit  16#, 30#-220#, 350/400#
  Bond  Very soft to Xtreme hard
  Fit Machine  HTC Grinder



Diamond Metal Bond Grinding Segment for Floor Surface

Diamond Metal Bond Grinding Segment for Floor Surface

Diamond Metal Bond Grinding Segment for Floor Surface


Diamond Metal Bond Grinding Segment for Floor Surface
Diamond Metal Bond Grinding Segment for Floor Surface



Diamond Metal Bond Grinding Segment for Floor Surface