UL cUL Impedance Control Electronic Board with Fast Lead Time
China UL cUL Impedance Control Electronic Board with Fast Lead Time, Find details about China PCB, Motherboard from UL cUL Impedance Control Electronic Board with Fast Lead Time
Basic Info.
Model NO.
8layer pcb
Condition
Used
Mini Hole
0.15mm
Mini Width/Space
4/4mil
Board Thickness
2.0mm
Soldermask
Green
Silkscreen
White
Finish
Immersion Gold 2u"
Copper
1oz
Material
Fr4/Sytg170
Trademark
Coenrichpcb
Transport Package
Vacumme
Specification
98mm x 98mm
Origin
Made in China
HS Code
8534009000
Model NO.
8layer pcb
Condition
Used
Mini Hole
0.15mm
Mini Width/Space
4/4mil
Board Thickness
2.0mm
Soldermask
Green
Silkscreen
White
Finish
Immersion Gold 2u"
Copper
1oz
Material
Fr4/Sytg170
Trademark
Coenrichpcb
Transport Package
Vacumme
Specification
98mm x 98mm
Origin
Made in China
HS Code
8534009000
Product Desciption
Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.
Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%
Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%
| Capability for Rigid PCB Production | ||
| NO. | ITEM | TECHNICAL DATA |
| 1 | Types of Products | Multilayer PCB, Buried/Blind Via PCB, High Frequency PCB, Rigid-Flexible PCB, Teflon Board, HDI, Aluminum Base PCB. |
| 2 | Materials | FR-4, Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, Black FR4 |
| 3 | Layers | 2-32(layers) |
| 4 | Max Board Size | 450 x 660mm 18" x 26" |
| 5 | Min Board Thickness | 4(layers) 0.40mm 16mil |
| 6(layers) 0.80mm 32mil | ||
| 8(layers) 1.00mm 40mil | ||
| 10(layers) 1.20mm 48mil | ||
| 6 | Copper Clad(Max.) | 20oz(outer) / 4oz(inner) |
| 7 | Min line Width/space | 0.075mm 3mil |
| 8 | Drill Size Mechanical (min) | 0.20mm 8mil |
| 9 | Drill Size Laser(min) | 0.10mm 4mil |
| 10 | PTH Wall Thickness | 0.020mm 0.8mil |
| 11 | PTH dia tolerance | ±0.075mm ±3mil |
| 12 | NPTH hole dia tolerance | ±0.05mm ±2mil |
| 13 | Hole Position Deviation | ±0.05mm ±2mil |
| 14 | Outline Tolerance | ±0.10mm ±4mil |
| 15 | S/M Pitch | 0.08mm 3mil |
| 16 | Insulation Resistance | 1E+12Ω(Normal) |
| 17 | Test Voltage | 50~300V |
| 18 | Aspect ratio | 8:1 |
| 19 | Thermal Shock | 3x10Sec@288 ºC |
| 20 | Warp and Twist | ≤0.75% |
| 21 | Current breakdown | 10A |
| 22 | Electric Strength | >1.3KV/mm |
| 23 | Peel Strength | 1.4N/mm |
| 24 | Solder Mask Abrasion | ≥6H |
| 25 | Flammability | 94V-0 |
| 26 | Impedance Control | ±10% |
| 27 | Buried Via | Yes |
| 28 | Blind Via | Yes |
| 29 | HDI | 2+N+2 4mil Via hole |
| 30 | Surface Finished | ENIG, ImAg, ImSn, OSP, HASL Free |
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