Quick Turn Sample PCB Fast Mass Production PCB Assembly Clear PCB 2layer PCB Enig Electronics Board Made by China PCBA Factory, Find details about China PCB, Mother Board from Quick Turn Sample PCB Fast Mass Production PCB Assembly Clear PCB 2layer PCB Enig Electronics Board Made by China PCBA Factory
Rigid PCB Production Capacity | ||
SERIAL | ITEM | TECHNICAL DATA |
1 | Types of Products | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI |
2 | Layers | 2-32(layers) |
3 | Max Board Size | 450x660mm 18" x 26" |
4 | Min Board Thickness | 4(layers)0.40mm 16mil |
6(layers)0.80mm 32mil | ||
8(layers)1.00mm 40mil | ||
10(layers)1.20mm 48mil | ||
5 | Copper Clad(Max.) | 20 oz(outer)/4 oz(inner) |
6 | Min line Width/space | 0.075mm 3mil |
7 | Drill Size Mechanical (min) | 0.20mm 8mil |
8 | Drill Size Laser(min) | 0.10mm 4mil |
9 | PTH Wall Thickness | 0.020mm 0.8mil |
10 | PTH dia tolerance | ±0.075mm ±3mil |
11 | NPTH hole dia tolerance | ±0.05mm ±2mil |
12 | Hole Position Deviation | ±0.05mm ±2mil |
13 | Outline Tolerance | ±0.10mm ±4mil |
14 | S/M Pitch | 0.08mm 3mil |
15 | Insulation Resistance | 1E+12Ω(Normal) |
16 | Test Voltage | 50~300V |
17 | Aspect ratio | 8:01 |
18 | Thermal Shock | 3x10Sec@288 ºC |
19 | Warp and Twist | ≤0.7% |
20 | Current breakdown | 10A |
21 | Electric Strength | >1.3KV/mm |
22 | Peel Strength | 1.4N/mm |
23 | Solder Mask Abrasion | ≥6H |
24 | Flammability | 94V-0 |
25 | Impedance Control | +/-10%(Differential) |
26 | Buried Via | Yes |
27 | Blind Via | Yes |
28 | HDI | 2+N+2 4mil Via hole |
29 | Surface Finished | ENIG, ImAg, ImSn, OSP, HASL free |
30 | Materials | FR-4 , Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, black Fr4 |